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Journal Articles
Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
Available to PurchaseJun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
Published Online: April 17, 2020
Journal Articles
Study on BEOL Failures in a Chip by Shear Tests of Copper Pillar Bumps
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011003.
Paper No: EP-18-1037
Published Online: February 25, 2019
Journal Articles
Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031016.
Paper No: EP-15-1016
Published Online: July 21, 2015