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Jong-Min Kim
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Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

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Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
https://doi.org/10.1115/1.4038028
Published Online: October 13, 2017
View Articletitled, Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
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Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)
Journal Articles

Adhesive Joining Process and Joint Property With Low Melting Point Filler

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Kiyokazu Yasuda, Jong-Min Kim, Kozo Fujimoto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
https://doi.org/10.1115/1.1846060
Published Online: March 21, 2005
View Articletitled, Adhesive Joining Process and Joint Property With Low Melting Point Filler
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Topics: Adhesives, Alloys, Fillers (Materials), Heat conduction, Melting point, Resins, Joining, Copper, Epoxy resins, Self-organization
Journal Articles

Resin Self-Alignment Processes for Self-Assembly Systems

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Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
https://doi.org/10.1115/1.1846061
Published Online: March 21, 2005
View Articletitled, Resin Self-Alignment Processes for Self-Assembly Systems
Open the PDF for Resin Self-Alignment Processes for Self-Assembly Systems in another window
Topics: Resins, Surface tension, Self-assembly