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Journal Articles

Special Issue With Contributions From ITherm 2004

Free
K. Ramakrishna, Bahgat G. Sammakia, J. Richard Culham, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 2006, 128(2): 101.
https://doi.org/10.1115/1.2188607
Published Online: June 1, 2006
View Articletitled, Special Issue With Contributions From ITherm 2004
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Topics: Electronic packaging, Packaging, Thermal management, Heat transfer
Journal Articles

The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks

Available to Purchase
J. Richard Culham, Waqar A. Khan, M. Michael Yovanovich, Yuri S. Muzychka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 76–81.
https://doi.org/10.1115/1.2429713
Published Online: March 31, 2006
View Articletitled, The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks
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Topics: Design, Heat sinks, Thermal conductivity, Optimization
Journal Articles

Modeling of Natural Convection in Electronic Enclosures

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Peter M. Teertstra, M. Michael Yovanovich, J. Richard Culham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 157–165.
https://doi.org/10.1115/1.2188953
Published Online: September 28, 2005
View Articletitled, Modeling of Natural Convection in Electronic Enclosures
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Topics: Boundary layers, Computational fluid dynamics, Convection, Engineering simulation, Heat conduction, Natural convection, Shapes, Simulation, Flow (Dynamics), Model validation