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I. Ahmad
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Journal Articles

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

Available to Purchase
M. K. Md Arshad, I. Ahmad, A. Jalar, G. Omar, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
https://doi.org/10.1115/1.2229223
Published Online: November 29, 2005
View Articletitled, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
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Topics: Adhesion, Aluminum, Atomic force microscopy, Nickel, Shear strength, Solders, Focused ion beams, Metallurgy, Scanning electron microscopy, X-rays
Journal Articles

Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

Available to Purchase
Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal, Z. Fathi, I. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 302–307.
https://doi.org/10.1115/1.1571077
Published Online: June 10, 2003
View Articletitled, Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications
Open the PDF for Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications in another window
Topics: Convection, Delamination, Fillers (Materials), Flip-chip, Microwaves, Ovens, Particulate matter