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Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Available to Purchase
Y. Ju, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 42–46.
https://doi.org/10.1115/1.1326440
Published Online: July 18, 2000
View Articletitled, Microwave Imaging for the Integrity Assessment of IC Packages
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Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes
Journal Articles

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Available to Purchase
S. Kamiya, H. Takahashi, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 367–371.
https://doi.org/10.1115/1.2792648
Published Online: December 1, 1998
View Articletitled, Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Journal Articles

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Available to Purchase
K. Sasagawa, N. Nakamura, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 360–366.
https://doi.org/10.1115/1.2792647
Published Online: December 1, 1998
View Articletitled, A New Approach to Calculate Atomic Flux Divergence by Electromigration
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Topics: Electrodiffusion, Corners (Structural elements), Current density, Temperature, Computational methods
Journal Articles

The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

Available to Purchase
M. Muraoka, H. Abe´, N. Aizawa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 403–406.
https://doi.org/10.1115/1.2905472
Published Online: December 1, 1992
View Articletitled, The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber
Open the PDF for The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber in another window
Topics: Fibers, Fracture (Materials), Optical glass, Stress, Boundary element methods, Geometry, Optical fiber