1-2 of 2
Guillermo Paniagua
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Available to Purchase
Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011008.
Paper No: EP-20-1121
https://doi.org/10.1115/1.4050200
Published Online: August 6, 2021
View Articletitled, Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods
Open the PDF for Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods in another window
Topics: Electronic packages, Heat, Temperature, Errors, Heat conduction
Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Available to Purchase
David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
https://doi.org/10.1115/1.4039026
Published Online: March 2, 2018
View Articletitled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
Open the PDF for Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips in another window
Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms