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Journal Articles

A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

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J. K. Chen, J. E. Beraun, D. Y. Tzou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 52–57.
https://doi.org/10.1115/1.1326438
Published Online: June 27, 2000
View Articletitled, A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints
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Topics: Diffusion (Physics), Intermetallic compounds, Solder joints, Chemical reactions