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Bengt Sundén
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Journal Articles

Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

Gongnan Xie, Masoud Asadi, Bengt Sunden, Shaofei Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031013.
Paper No: EP-13-1138
https://doi.org/10.1115/1.4027728
Published Online: June 10, 2014
View Articletitled, Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime
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Topics: Design, Flow (Dynamics), Geometry, Heat transfer, Optimization, Reynolds number, Thermal resistance, Vortices, Wavelength, Degrees of freedom
Journal Articles

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Bengt Sundén, Gongnan Xie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2014, 136(2): 024501.
Paper No: EP-13-1058
https://doi.org/10.1115/1.4026538
Published Online: April 29, 2014
View Articletitled, Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink
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Topics: Cooling, Heat, Heat sinks, Strips, Temperature, Thermal analysis, Thermal resistance, Electrical conductance, Invar, Temperature distribution
Journal Articles

Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling

Gongnan Xie, Jian Liu, Yanquan Liu, Bengt Sunden, Weihong Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021008.
Paper No: EP-12-1104
https://doi.org/10.1115/1.4023530
Published Online: March 28, 2013
View Articletitled, Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling
Open the PDF for Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling in another window
Topics: Heat transfer, Microchannels, Heat sinks, Pressure drop, Reynolds number, Flow (Dynamics)
Journal Articles

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

Gongnan Xie, Jian Liu, Weihong Zhang, Bengt Sunden
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041010.
https://doi.org/10.1115/1.4023035
Published Online: December 6, 2012
View Articletitled, Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
Open the PDF for Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling in another window
Topics: Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Cooling, Reynolds number