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Ankur Jain
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Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

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Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Articletitled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

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Leila Choobineh, Jared Jones, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
https://doi.org/10.1115/1.4036404
Published Online: June 12, 2017
View Articletitled, Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis
Journal Articles

Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

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Fahad Mirza, Gaurang Naware, Ankur Jain, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041008.
Paper No: EP-13-1122
https://doi.org/10.1115/1.4028076
Published Online: September 19, 2014
View Articletitled, Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications
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Topics: Heating, Joules, Junctions, Mechanical admittance, Silicon, Temperature, Heat, Temperature distribution