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Amip J. Shah
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Journal Articles

Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

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David J. Lettieri, Michael M. Toulouse, Cullen E. Bash, Amip J. Shah, Van P. Carey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030903.
Paper No: EP-12-1090
https://doi.org/10.1115/1.4024302
Published Online: July 24, 2013
View Articletitled, Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers
Open the PDF for Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers in another window
Topics: Buoyancy, Computational fluid dynamics, Data centers, Flow (Dynamics), Temperature, Vortices, Server racks, Approximation
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

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Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041009.
https://doi.org/10.1115/1.4007744
Published Online: November 26, 2012
View Articletitled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency in another window
Topics: Cooling, Data centers, Heat sinks, Leakage, Temperature, Energy consumption, Heat
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

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Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041006.
https://doi.org/10.1115/1.4007110
Published Online: October 30, 2012
View Articletitled, From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency in another window
Topics: Containment, Data centers, Heat, Heat sinks, Temperature, Air flow
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

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Ed J. Walsh, Thomas J. Breen, Jeff Punch, Amip J. Shah, Cullen E. Bash
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
https://doi.org/10.1115/1.4004657
Published Online: September 21, 2011
View Articletitled, From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
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Topics: Cooling, Cooling towers, Data centers, Heat sinks, Temperature, Temperature control, Modeling, Thermal resistance, Flow (Dynamics)
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

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Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011004.
https://doi.org/10.1115/1.4003274
Published Online: March 9, 2011
View Articletitled, From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet in another window
Topics: Cooling, Cooling towers, Data centers, Temperature, Cooling systems, Heat, Modeling, Flow (Dynamics)
Journal Articles

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

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Jason M. Brand, Salvatore A. Ruggero, Amip J. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011011.
https://doi.org/10.1115/1.2837561
Published Online: February 12, 2008
View Articletitled, Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages
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Topics: Cavities, Compression, Flow (Dynamics), Wire, Packaging, Stress, Vehicles, Deformation, Bonding
Journal Articles

An Exergy-Based Figure-of-Merit for Electronic Packages

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Amip J. Shah, Van P. Carey, Cullen E. Bash, Chandrakant D. Patel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 360–369.
https://doi.org/10.1115/1.2351901
Published Online: December 13, 2005
View Articletitled, An Exergy-Based Figure-of-Merit for Electronic Packages
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Topics: Exergy, Energy dissipation, Junctions, Cooling, Heat sinks, Temperature