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Aaron P. Wemhoff
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041002.
Paper No: EP-21-1044
Published Online: October 6, 2021
Journal Articles
Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021001.
Paper No: EP-19-1102
Published Online: August 7, 2020
Journal Articles
Thermal Control Strategies for Reliable and Energy-Efficient Data Centers
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041004.
Paper No: EP-18-1058
Published Online: July 12, 2019