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Journal Articles
Accepted Manuscript
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-19-1056
Published Online: September 1, 2019
Journal Articles
Accepted Manuscript
Article Type: Technical Briefs
J. Electron. Packag.
Paper No: EP-19-1039
Published Online: September 1, 2019
Journal Articles
Accepted Manuscript
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-18-1090
Published Online: September 1, 2019
Journal Articles
Accepted Manuscript
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-19-1066
Published Online: September 1, 2019
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Three gap formation scenarios of case I where the maximum warpage differenc...
Published Online: August 1, 2019
Fig. 3 Three gap formation scenarios of case I where the maximum warpage difference occurs at the corner of the package: ( a ) scenario-1, ( b ) scenario-2, and ( c ) scenario-3 More
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Deformed configurations (5× magnification) of ( a ) the top and ( b ) the b...
Published Online: August 1, 2019
Fig. 3 Deformed configurations (5× magnification) of ( a ) the top and ( b ) the bottom packages with the nominal design parameters at the peak reflow temperature More
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Statistical correlations of the warpages at the  j th pad and the outmost c...
Published Online: August 1, 2019
Fig. 5 Statistical correlations of the warpages at the j th pad and the outmost corner pad: ( a ) pad locations, ( b ) top package, and ( c ) bottom package More
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Shape prediction results of ( a ) the top and ( b ) bottom solder balls aft...
Published Online: August 1, 2019
Fig. 8 Shape prediction results of ( a ) the top and ( b ) bottom solder balls after the first reflow, and ( c ) the solder joint after the second reflow More
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( a ) PDF of the top solder ball height, ( b ) PDF of the bottom solder bal...
Published Online: August 1, 2019
Fig. 9 ( a ) PDF of the top solder ball height, ( b ) PDF of the bottom solder ball height, and ( c ) PDF of the solder joint height More