Skip Nav Destination
Issues
June 2025
In Progress
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag. June 2025, 147(2): 021001.
doi: https://doi.org/10.1115/1.4067137
Topics:
Deformation
,
Density
,
Finite element analysis
,
Solders
,
Stress
,
Thermomechanics
,
Creep
,
Simulation
,
Alloys
,
Hardening
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag. June 2025, 147(2): 021002.
doi: https://doi.org/10.1115/1.4067189
Topics:
Current density
,
Electrodiffusion
,
Fatigue
,
Reliability
,
Solder joints
,
Stress
,
Temperature
,
Spectral energy distribution
,
Vehicles
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
Bharath Ramakrishnan, Cam Turner, Husam Alissa, Dennis Trieu, Felipe Rivera, Luke Melton, Muralikrishna Rao, Sruti Chigullapalli, Tatek Getachew, Vladimir Prodanovic, Robert Lankston, Christian Belady, Vaidehi Oruganti
J. Electron. Packag. June 2025, 147(2): 021003.
doi: https://doi.org/10.1115/1.4067136
Topics:
Artificial intelligence
,
Cooling
,
Data centers
,
Energy consumption
,
Graphics processing units
,
Machine learning
,
Temperature
,
Stress
,
Coolants
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
J. Electron. Packag. June 2025, 147(2): 021004.
doi: https://doi.org/10.1115/1.4067269
Topics:
Capacitance
,
Ceramics
,
Circuits
,
Skin effect
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
J. Electron. Packag. June 2025, 147(2): 021005.
doi: https://doi.org/10.1115/1.4067377
Topics:
Condensation
,
Condensers (steam plant)
,
Flow (Dynamics)
,
Fluids
,
Friction
,
Heat exchangers
,
Pressure
,
Refrigerants
,
Temperature
,
Heat transfer
Email alerts
RSS Feeds
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
J. Electron. Packag (June 2025)
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
J. Electron. Packag (June 2025)
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
