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Issues

Volume 146, Issue 1
March 2024
In Progress
Issue Cover
ISSN 1043-7398
EISSN 1528-9044
In this Issue

Research Papers

Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe3O4-Magnetic Particle Chained Pillar Array Structure
Zong-Tao Li, Jun-Hao Wu, Guan-Wei Liang, Ren-peng Yang, Zhihui Yang, Jia-Sheng Li
J. Electron. Packag. March 2024, 146(1): 011001. doi: https://doi.org/10.1115/1.4062383
View articletitled, Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe<sub>3</sub>O<sub>4</sub>-Magnetic Particle Chained Pillar Array Structure
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Topics: Columns (Structural) , Particulate matter , Reflectance
Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
Ke Zhong, Huanpeng Wang, Jingrou Wang, Yuehang Xu
J. Electron. Packag. March 2024, 146(1): 011002. doi: https://doi.org/10.1115/1.4062344
View articletitled, Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
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Topics: Ball-Grid-Array packaging , Fatigue life , Heat , Heating , Reliability , Solders , Stress , Temperature , Thermal shock , Cycles
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component
Markus Tauscher, Tobias Merk, Aniket Adsule, Andreas Linnemann, Jürgen Wilde
J. Electron. Packag. March 2024, 146(1): 011003. doi: https://doi.org/10.1115/1.4062404
View articletitled, Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component
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Topics: Ball-Grid-Array packaging , Creep , Fatigue , Solders , Cycles , Deformation
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
Peter Lukacs, Tibor Rovensky, Alexandr Otahal
J. Electron. Packag. March 2024, 146(1): 011004. doi: https://doi.org/10.1115/1.4062470
View articletitled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics) , Lead-free solders , Printed circuit boards , Solder joints , Soldering , Solders , Surface mount devices , Capacitors , Dislocations , Reliability
All Issues
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
J. Electron. Packag (March 2024)
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
J. Electron. Packag
Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic
J. Electron. Packag
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
J. Electron. Packag (December 2023)
Recent Advances And Trends In Chiplet Design And Heterogeneous Integration Packaging
J. Electron. Packag
  • Online ISSN 1528-9044
  • Print ISSN 1043-7398

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