Topics: Cross section (Physics) , Lead-free solders , Printed circuit boards , Solder joints , Soldering , Solders , Surface mount devices , Capacitors , Dislocations , Reliability

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng

J. Electron. Packag. March 2024, 146(1): 011005. doi: https://doi.org/10.1115/1.4062531

Abstract

View articletitled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

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Topics: Flow (Dynamics) , Heat transfer , Microchannels , Shapes , Temperature , Fins , Circuits , Cooling , Integrated circuits

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson

J. Electron. Packag. March 2024, 146(1): 011006. doi: https://doi.org/10.1115/1.4062384

Abstract

View articletitled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

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Topics: Manifolds , Microchannels , Pressure drop , Flow (Dynamics) , Thermal resistance , Cooling , Computational fluid dynamics

Interfacial Fracture Caused by Electromigration at Copper Interconnects

Yuexing Wang, Bofeng Li, Yao Zhifeng, Yao Yao

J. Electron. Packag. March 2024, 146(1): 011007. doi: https://doi.org/10.1115/1.4062828

Abstract

View articletitled, Interfacial Fracture Caused by Electromigration at Copper Interconnects

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Topics: Copper , Electrodiffusion , Fracture (Materials) , Fracture (Process) , Stress , Fracture toughness , Dislocations , Anodes

Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Xin Wei, Abdallah Alakayleh

J. Electron. Packag. March 2024, 146(1): 011008. doi: https://doi.org/10.1115/1.4062894

Abstract

View articletitled, Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

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Topics: Alloys , Creep , Stress , Solder joints , Solders

Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method

Chao Gao, Chunyue Huang, Liang Ying

J. Electron. Packag. March 2024, 146(1): 011009. doi: https://doi.org/10.1115/1.4064097

Abstract

View articletitled, Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method

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Topics: Design , Manufacturing , Solder joints , Stress , Taguchi methods , Reliability , Fatigue life , Optimization , Ball-Grid-Array packaging

Errata

Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]

Wing K. Yeung, Tung T. Lam

J. Electron. Packag. March 2024, 146(1): 017001. doi: https://doi.org/10.1115/1.4063174

Extract

View articletitled, Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]

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Topics: Electrons , Current density

Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. March 2024, 146(1): 017002. doi: https://doi.org/10.1115/1.4063546

Extract

View articletitled, Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)

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Topics: Dynamic modeling , Electrons , Power conversion systems , Stress

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Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Interfacial Fracture Caused by Electromigration at Copper Interconnects

Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method

Errata

Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]

Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)

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