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Issues
December 2023
In Progress
ISSN 1043-7398
EISSN 1528-9044
Special Papers
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
J. Electron. Packag. December 2023, 145(4): 041101.
doi: https://doi.org/10.1115/1.4062403
Topics:
Boilers
,
Boiling
,
Bose-Einstein condensates
,
Cooling
,
Fluids
,
Junctions
,
Slug flows
,
Temperature
,
Thermal resistance
,
Vehicles
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