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Volume 145, Issue 4

December 2023

In Progress

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ISSN 1043-7398

EISSN 1528-9044

Special Papers

Special Papers

Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Jimil M. Shah, Thomas Crandall, Phillip E. Tuma

J. Electron. Packag. December 2023, 145(4): 041101. doi: https://doi.org/10.1115/1.4062403

View articletitled, Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Click here to open pdf in another window PDF for

Topics: Boilers , Boiling , Bose-Einstein condensates , Cooling , Fluids , Junctions , Slug flows , Temperature , Thermal resistance , Vehicles

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Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

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