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Issues
March 2023
In Progress
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
J. Electron. Packag. March 2023, 145(1): 011201.
doi: https://doi.org/10.1115/1.4054651
Topics:
Heat
,
Phase change materials
,
Steady state
,
Temperature
,
Transients (Dynamics)
,
Melting
,
Copper
,
Heat sinks
,
Tradeoffs
,
Simulation
Electrothermal Analysis of System in Package for Aerospace Application
J. Electron. Packag. March 2023, 145(1): 011202.
doi: https://doi.org/10.1115/1.4054462
Topics:
Aerospace industry
,
Design
,
Heat
,
Joules
,
Reliability
,
Simulation
,
System-in-package
,
Temperature
,
Vacuum
,
Errors
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
J. Electron. Packag. March 2023, 145(1): 011203.
doi: https://doi.org/10.1115/1.4054698
Topics:
Diffusion (Physics)
,
Gallium nitride
,
Heat
,
Heating
,
Modeling
,
Phonons
,
Simulation
,
Temperature
,
Heat conduction
,
Junctions
-
Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
J. Electron. Packag. March 2023, 145(1): 011204.
doi: https://doi.org/10.1115/1.4054784
Topics:
Glass transition
,
Reliability
,
Semiconductor wafers
,
Storage
,
Stress
,
Temperature
,
Testing
,
Viscoelasticity
,
Solders
,
Failure
The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
J. Electron. Packag. March 2023, 145(1): 011205.
doi: https://doi.org/10.1115/1.4054821
Topics:
Algebra
,
Deformation
,
Differential equations
,
Genetic algorithms
,
Stress
,
Errors
,
Solders
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks
J. Electron. Packag. March 2023, 145(1): 011206.
doi: https://doi.org/10.1115/1.4054822
Topics:
Shock (Mechanics)
,
Contact resistance
,
Displacement
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Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
J. Electron. Packag (June 2023)
Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
J. Electron. Packag (March 2023)
The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
J. Electron. Packag (March 2023)
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks
J. Electron. Packag (March 2023)
