Volume 142 Issue 4 | J. Electron. Packag.

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Volume 142, Issue 4

December 2020

ISSN 1043-7398

EISSN 1528-9044

Special Issue on InterPACK 2019 – Part 2

Review Article

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu

J. Electron. Packag. December 2020, 142(4): 040801. doi: https://doi.org/10.1115/1.4047472

Abstract

View articletitled, Comparative Study on Power Module Architectures for Modularity and Scalability

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Topics: Architecture , Cooling , Design , Electric vehicles , Electronics , Patents , Hybrid electric vehicles , Traction , Coolants , Metals

Research Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer

J. Electron. Packag. December 2020, 142(4): 041001. doi: https://doi.org/10.1115/1.4048109

Abstract

View articletitled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

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Topics: Fatigue life , Shear (Mechanics) , Stress , Fatigue , Solder joints , Cycles , Fatigue testing , Solders

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Sadegh Khalili, Srikanth Rangarajan, Vadim Gektin, Husam Alissa, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041002. doi: https://doi.org/10.1115/1.4048180

Abstract

View articletitled, An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

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Topics: Coolants , Cooling , Cooling systems , Flow (Dynamics) , Fluids , Heat , Manifolds , Pressure , Stress , Temperature

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Benjamin Leever, Scott Miller

J. Electron. Packag. December 2020, 142(4): 041003. doi: https://doi.org/10.1115/1.4048535

Abstract

View articletitled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

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Topics: Aerosols , Electrical resistivity , Failure , Inks , Shear (Mechanics) , Sintering , Stress , Temperature , Elastic moduli , Printing

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo

J. Electron. Packag. December 2020, 142(4): 041004. doi: https://doi.org/10.1115/1.4048493

Abstract

View articletitled, Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

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Topics: Additive manufacturing , Coolants , Cooling , Design , Electromagnetic interference , Flat heat pipes , Flow (Dynamics) , Fluids , Heat , Heat transfer

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L, Huanyu Liao, Ganesh Subbarayan

J. Electron. Packag. December 2020, 142(4): 041005. doi: https://doi.org/10.1115/1.4048729

Abstract

View articletitled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

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Topics: Algorithms , Particulate matter , Optimization , Network models

Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study

Hui Xiong, Liaoxin Sun

J. Electron. Packag. December 2020, 142(4): 041101. doi: https://doi.org/10.1115/1.4047190

Abstract

View articletitled, Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study

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Topics: Design , Diffraction , Diffraction patterns , Optical elements , Lasers , Construction

Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

Omri Tayyara, Carlos Da Silva, Miad Nasr, Amir Assadi, Kshitij Gupta, Olivier Trescases, Cristina H. Amon

J. Electron. Packag. December 2020, 142(4): 041102. doi: https://doi.org/10.1115/1.4047226

Abstract

View articletitled, Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

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Topics: Design , Electric vehicles , Engineering simulation , Simulation , Heat , Temperature , MOSFET transistors , Inductors , Cooling , Circuits

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler

J. Electron. Packag. December 2020, 142(4): 041103. doi: https://doi.org/10.1115/1.4047469

Abstract

View articletitled, Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

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Topics: Data centers , Dust , Leakage , Particulate matter , Sensors

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

J. Electron. Packag. December 2020, 142(4): 041104. doi: https://doi.org/10.1115/1.4047392

Abstract

View articletitled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

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Topics: Elastic moduli , Mechanical properties , Stress , Temperature , Tensile strength , Storage , Solders

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi

J. Electron. Packag. December 2020, 142(4): 041105. doi: https://doi.org/10.1115/1.4047459

Abstract

View articletitled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

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Topics: Computer cooling , Electrohydrodynamics , Flow (Dynamics) , Fluids , Heat conduction , Pumps , Electrodes , Design , Electric fields

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Weicheng Shu, Jiawen Wang, Xinfeng Zhang, Xiaobing Luo

J. Electron. Packag. December 2020, 142(4): 041106. doi: https://doi.org/10.1115/1.4047470

Abstract

View articletitled, A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

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Topics: Cooling , Experimental design , Ice , Temperature , Heat

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury

J. Electron. Packag. December 2020, 142(4): 041107. doi: https://doi.org/10.1115/1.4047409

Abstract

View articletitled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

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Topics: Design , Energy gap , Heat , Junctions , Metals , MOSFET transistors , Steady state , Temperature , Thermal analysis , Transients (Dynamics)

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink

J. Electron. Packag. December 2020, 142(4): 041108. doi: https://doi.org/10.1115/1.4047497

Abstract

View articletitled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

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Topics: Cooling , Electronics , Heat , Phase change materials , Reliability , Temperature , Thermal management , Heat sinks , Design , Convection

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041109. doi: https://doi.org/10.1115/1.4047471

Abstract

View articletitled, Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

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Topics: Genetic algorithms , Heat , Optimization , Temperature , Artificial neural networks , Heat transfer , Integrated circuits , Algorithms , Boundary-value problems

Additively Printed Multilayer Substrate Using Aerosol-Jet Technique

Pradeep Lall, Kartik Goyal, Nakul Kothari, Benjamin Leever, Scott Miller

J. Electron. Packag. December 2020, 142(4): 041110. doi: https://doi.org/10.1115/1.4047473

Abstract

View articletitled, Additively Printed Multilayer Substrate Using Aerosol-Jet Technique

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Topics: Aerosols , Inks , Sintering , Design , Modeling

A System to Package Perspective on Transient Thermal Management of Electronics

H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler

J. Electron. Packag. December 2020, 142(4): 041111. doi: https://doi.org/10.1115/1.4047474

Abstract

View articletitled, A System to Package Perspective on Transient Thermal Management of Electronics

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Topics: Transients (Dynamics) , Thermal management , Design , Phase change materials , Temperature , Heat

The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates

Yiwen Song, James Spencer Lundh, Weijie Wang, Jacob H. Leach, Devon Eichfeld, Anusha Krishnan, Carlos Perez, Dong Ji, Trent Borman, Kevin Ferri, Jon-Paul Maria, Srabanti Chowdhury, Jae-Hyun Ryou, Brian M. Foley, Sukwon Choi

J. Electron. Packag. December 2020, 142(4): 041112. doi: https://doi.org/10.1115/1.4047578

Abstract

View articletitled, The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates

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Topics: Gallium nitride , Thermal conductivity , Phonons , Raman spectroscopy , Steady state , Thermoreflectance

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

J. Electron. Packag. December 2020, 142(4): 041113. doi: https://doi.org/10.1115/1.4047579

Abstract

View articletitled, Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

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Topics: Cycles , Failure , Flexible electronics , Modeling , Reliability , Electronics , Regression models , Failure analysis

Special Issue on InterPACK 2019 – Part 2

Review Article

Comparative Study on Power Module Architectures for Modularity and Scalability

Research Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Design of Diffractive Optical Elements by Direct and Indirect Construction of Diffraction Pattern: A Comparative Study

Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Additively Printed Multilayer Substrate Using Aerosol-Jet Technique

A System to Package Perspective on Transient Thermal Management of Electronics

The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

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Special Issue on InterPACK 2019 – Part 2

Review Article

Research Papers

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