Volume 142 Issue 3 | J. Electron. Packag.

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Volume 142, Issue 3

September 2020

ISSN 1043-7398

EISSN 1528-9044

Guest Editorial

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang

J. Electron. Packag. September 2020, 142(3): 030301. doi: https://doi.org/10.1115/1.4048039

Extract

View articletitled, Special Issue on InterPACK 2019 – Part 1

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Topics: Cloud computing , Electric vehicles , Electronic packaging , Electronics , Energy conversion , Engineering teachers , Feedback , Internet of things , Manufacturing , Mechanical engineers

Special Papers

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo

J. Electron. Packag. September 2020, 142(3): 031101. doi: https://doi.org/10.1115/1.4046763

Abstract

View articletitled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

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Topics: Coating processes , Coatings , Composite materials , Crystals , Density , Particulate matter , Phosphors , Power density , Lasers , Aluminum

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai

J. Electron. Packag. September 2020, 142(3): 031102. doi: https://doi.org/10.1115/1.4046764

Abstract

View articletitled, Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

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Topics: Electrodes , Irradiation (Radiation exposure) , Nanowires , Transparency , Ultraviolet radiation , Light-emitting diodes , Welding

Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow

Yuejin Wang, Guozhen Liu, Shiqiang Lu, Bin Guo, Hongye Zhang, Fuchun Xu, Xiaohong Chen, Duanjun Cai, Junyong Kang

J. Electron. Packag. September 2020, 142(3): 031103. doi: https://doi.org/10.1115/1.4046765

Abstract

View articletitled, Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow

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Topics: Boron , Gas flow , Magnesium (Metal) , Nitrogen , Thermal conductivity , Optoelectronic devices

The Optical Properties of Dual-Wavelength In_xGa_1−xN/GaN Nanorods for Wide-Spectrum Light-Emitting Diodes

Jie Zhao, Xuecheng Wei, Dongdong Liang, Qiang Hu, Jianchang Yan, Junxi Wang, Tongbo Wei

J. Electron. Packag. September 2020, 142(3): 031104. doi: https://doi.org/10.1115/1.4046766

Abstract

View articletitled, The Optical Properties of Dual-Wavelength InxGa1−xN/GaN Nanorods for Wide-Spectrum Light-Emitting Diodes

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Topics: Gallium nitride , Light-emitting diodes , Nanorods , Wavelength , Emissions , Temperature

Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won

J. Electron. Packag. September 2020, 142(3): 031105. doi: https://doi.org/10.1115/1.4046767

Abstract

View articletitled, Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Supplementary data

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Topics: Evaporation , Fluorescence , Temperature , Vapors , Microscale devices

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106. doi: https://doi.org/10.1115/1.4046848

Abstract

View articletitled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

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Topics: Bonding , Columns (Structural) , Copper , Design , Gates (Closures) , Manufacturing , Modeling , Semiconductor wafers , Silicon , Tiles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. September 2020, 142(3): 031107. doi: https://doi.org/10.1115/1.4046849

Abstract

View articletitled, Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

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Topics: Circuits , Damage , Electrodiffusion , Failure analysis , Flexible electronics , Inks , Metals , Nanoparticles , Reliability , Density

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Tie Li, Guan-Long Cao, Hong-Juan Xie, Jing-Qin Wang, Zi-Hui Zhang

J. Electron. Packag. September 2020, 142(3): 031108. doi: https://doi.org/10.1115/1.4046934

Abstract

View articletitled, Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

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Topics: Electric fields , Electrons , Gallium nitride , Indium gallium nitride , Light-emitting diodes , Polarization (Electricity) , Polarization (Light) , Polarization (Waves) , Quantum wells , Leakage

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

Ange-Christian Iradukunda, Josh Kasitz, Hayden Carlton, David Huitink, Amol Deshpande, Fang Luo

J. Electron. Packag. September 2020, 142(3): 031109. doi: https://doi.org/10.1115/1.4046935

Abstract

View articletitled, Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

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Topics: Electrical properties , Electronics , Iron , Nanocomposites , Nanoparticles , Phase change materials , Temperature , Thermal conductivity , Thermal properties , Heat

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler

J. Electron. Packag. September 2020, 142(3): 031110. doi: https://doi.org/10.1115/1.4047063

Abstract

View articletitled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

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Topics: Cycles , Melting , Metals , Solidification , Temperature , Alloys , Stability

Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Hoyeon Kim, Noel C. Giebnik, Joon Seop Kwak, Jaehee Cho, Sukwon Choi

J. Electron. Packag. September 2020, 142(3): 031111. doi: https://doi.org/10.1115/1.4047015

Abstract

View articletitled, Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes

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Topics: Gallium nitride , Heating , Light-emitting diodes , Nanoparticles , Temperature , Temperature measurement , Microscopy

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Hayden Carlton, Dustin Pense, David Huitink

J. Electron. Packag. September 2020, 142(3): 031112. doi: https://doi.org/10.1115/1.4047099

Abstract

View articletitled, Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

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Topics: Temperature , Testing , Thermal resistance , Thermomechanics , Failure , Pumps , Steady state

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi

J. Electron. Packag. September 2020, 142(3): 031113. doi: https://doi.org/10.1115/1.4047100

Abstract

View articletitled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

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Topics: Dynamics (Mechanics) , Electronics , Energy gap , Gallium nitride , Heating , Imaging , Steady state , Temperature , Temperature measurement , Thermal characterization

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Jin Cui, Liang Pan, Justin A. Weibel

J. Electron. Packag. September 2020, 142(3): 031114. doi: https://doi.org/10.1115/1.4047356

Abstract

View articletitled, Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

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Topics: Heat sinks , Polymers , Surface roughness , Pressure , Thermal conductivity , Thermal resistance

Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

Hongfeng Jia, Huabin Yu, Zhongjie Ren, Chong Xing, Zhongling Liu, Yang Kang, Haiding Sun

J. Electron. Packag. September 2020, 142(3): 031115. doi: https://doi.org/10.1115/1.4047286

Abstract

View articletitled, Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

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Topics: Electrons , Light-emitting diodes , Leakage

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Ismail Turkmen, Cem Ahmet Mercan, Hamza Salih Erden

J. Electron. Packag. September 2020, 142(3): 031116. doi: https://doi.org/10.1115/1.4047845

Abstract

View articletitled, Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

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Topics: Air flow , Computational fluid dynamics , Cooling , Data centers , Flow (Dynamics) , Temperature , Tiles , Potential energy , Stress , Leakage

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031117. doi: https://doi.org/10.1115/1.4047846

Abstract

View articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

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Topics: Flow (Dynamics) , Fluids , Heat , Heat flux , Manifolds , Microchannels , Pressure drop , Temperature , Uncertainty , Cooling

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm²) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031118. doi: https://doi.org/10.1115/1.4047883

Abstract

View articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling

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Topics: Computational fluid dynamics , Design , Fluids , Manifolds , Microchannels , Pressure drop , Simulation , Coolers

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. September 2020, 142(3): 031119. doi: https://doi.org/10.1115/1.4047847

Abstract

View articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

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Topics: Coatings , Lasers , Manufacturing , Microcoolers , Micromachining , Silicon , Protective coatings , Bonding , Coating processes , Etching

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O'Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang

J. Electron. Packag. September 2020, 142(3): 031120. doi: https://doi.org/10.1115/1.4046933

Abstract

View articletitled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

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Topics: Glass , Heat , Manufacturing , Solar energy , Solar radiation , Temperature , Testing , Simulation , Liquid crystals , Computational fluid dynamics

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller

J. Electron. Packag. September 2020, 142(3): 031121. doi: https://doi.org/10.1115/1.4047844

Abstract

View articletitled, Flexure and Twist Test Reliability Assurance of Flexible Electronics

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Topics: Bending (Stress) , Cycles , Failure , Reliability , Sintering , Temperature , Inks , Flexible electronics , Testing , Printing

Guest Editorial

Special Issue on InterPACK 2019 – Part 1

Special Papers

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow

The Optical Properties of Dual-Wavelength In_xGa_1−xN/GaN Nanorods for Wide-Spectrum Light-Emitting Diodes

Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm²) Power Electronics Cooling

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Flexure and Twist Test Reliability Assurance of Flexible Electronics

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