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Issues
December 2013
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules
J. Electron. Packag. December 2013, 135(4): 041001.
doi: https://doi.org/10.1115/1.4024748
A Stepped-Bar Apparatus for Thermal Resistance Measurements
J. Electron. Packag. December 2013, 135(4): 041002.
doi: https://doi.org/10.1115/1.4025116
Topics:
Heat
,
Measurement uncertainty
,
Temperature
,
Thermal resistance
,
Thermocouples
,
Uncertainty
,
Thermal conductivity
,
Errors
,
Design
,
ASTM International
Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode
J. Electron. Packag. December 2013, 135(4): 041003.
doi: https://doi.org/10.1115/1.4025247
Topics:
High power lasers
,
Lasers
,
Silver
,
Thermal stresses
,
Finite element analysis
,
Temperature
,
Wavelength
,
Currents
,
Simulation
,
Manufacturing
Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
J. Electron. Packag. December 2013, 135(4): 041004.
doi: https://doi.org/10.1115/1.4025308
Topics:
Springs
,
Wire
,
Wire bonding
,
Deformation
Hygromechanical Analysis of Liquid Crystal Display Panels
J. Electron. Packag. December 2013, 135(4): 041005.
doi: https://doi.org/10.1115/1.4025527
Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias
J. Electron. Packag. December 2013, 135(4): 041006.
doi: https://doi.org/10.1115/1.4025531
Topics:
Cooling
,
Flow (Dynamics)
,
Heat sinks
,
Microchannels
,
Temperature
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
J. Electron. Packag. December 2013, 135(4): 041007.
doi: https://doi.org/10.1115/1.4025597
Topics:
Cycles
,
Design
,
Fatigue
,
Fatigue life
,
Reliability
,
Solder joints
,
Temperature
,
Materials properties
,
Stress
,
Taguchi methods
A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions
J. Electron. Packag. December 2013, 135(4): 041008.
doi: https://doi.org/10.1115/1.4025840
Topics:
Shear strength
Experimental and Modeling Studies of Looping Process for Wire Bonding
J. Electron. Packag. December 2013, 135(4): 041009.
doi: https://doi.org/10.1115/1.4025667
Topics:
Wire
,
Materials properties
,
Finite element model
Technical Briefs
Investigation on Laser Direct Welding of Quad Flat Pack Components
J. Electron. Packag. December 2013, 135(4): 044501.
doi: https://doi.org/10.1115/1.4025251
Topics:
Lasers
,
Temperature
,
Tensile strength
,
Welding
,
Solders
,
Laser welding
,
Tin
Errata
Erratum: “A Stepped-Bar Apparatus for Thermal Resistance Measurements” [Journal of Electronic Packaging, 2013, 135(4), 041002]
J. Electron. Packag. December 2013, 135(4): 047001.
doi: https://doi.org/10.1115/1.4025800
Topics:
Electronic packaging
,
Thermal resistance
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