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Issues
December 2012
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling
J. Electron. Packag. December 2012, 134(4): 041001.
doi: https://doi.org/10.1115/1.4007159
Topics:
Cooling
,
Design
,
Fluids
,
Optimization
,
Microchannels
,
Topology
,
Heat sinks
,
Temperature
,
Computer cooling
,
Heat transfer
Pull Force and Displacement of Cu/Au Wire Interconnects
J. Electron. Packag. December 2012, 134(4): 041002.
doi: https://doi.org/10.1115/1.4007233
Topics:
Displacement
,
Wire
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste
J. Electron. Packag. December 2012, 134(4): 041003.
doi: https://doi.org/10.1115/1.4007271
Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers
J. Electron. Packag. December 2012, 134(4): 041004.
doi: https://doi.org/10.1115/1.4007317
Topics:
Jets
,
Nozzles
,
Reynolds number
,
Flow (Dynamics)
Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
J. Electron. Packag. December 2012, 134(4): 041005.
doi: https://doi.org/10.1115/1.4007258
Topics:
Composite materials
,
Computer cooling
,
Flow (Dynamics)
,
Geometry
,
Heat
,
Heat sinks
,
Stress
,
Temperature
,
Thermal analysis
,
Epoxy adhesives
From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
J. Electron. Packag. December 2012, 134(4): 041006.
doi: https://doi.org/10.1115/1.4007110
Topics:
Containment
,
Data centers
,
Heat
,
Heat sinks
,
Temperature
,
Air flow
Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level
J. Electron. Packag. December 2012, 134(4): 041007.
doi: https://doi.org/10.1115/1.4007812
Topics:
Deformation
,
Failure
,
Printed circuit board assemblies
,
Screws
,
Stress
,
Vibration
,
Solder joints
,
Interferometry
,
Displacement
,
Boundary-value problems
Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling
J. Electron. Packag. December 2012, 134(4): 041008.
doi: https://doi.org/10.1115/1.4007674
Topics:
Cycles
,
Failure
,
Fracture (Materials)
,
Reliability
,
Solder joints
,
Failure mechanisms
,
Stress
,
Failure analysis
From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
J. Electron. Packag. December 2012, 134(4): 041009.
doi: https://doi.org/10.1115/1.4007744
Topics:
Cooling
,
Data centers
,
Heat sinks
,
Leakage
,
Temperature
,
Energy consumption
,
Heat
Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
J. Electron. Packag. December 2012, 134(4): 041010.
doi: https://doi.org/10.1115/1.4023035
Topics:
Flow (Dynamics)
,
Heat sinks
,
Microchannels
,
Pressure drop
,
Cooling
,
Reynolds number
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A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
J. Electron. Packag (March 2024)
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
J. Electron. Packag (December 2023)
