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Issues
December 2008
ISSN 1043-7398
EISSN 1528-9044
Editorial
Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
doi: https://doi.org/10.1115/1.3039759
Research Papers
Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing
J. Electron. Packag. December 2008, 130(4): 041001.
doi: https://doi.org/10.1115/1.2957325
Topics:
Electrodiffusion
,
Flip-chip
,
Reliability
,
Solder joints
,
Tin
,
Weight (Mass)
Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
J. Electron. Packag. December 2008, 130(4): 041002.
doi: https://doi.org/10.1115/1.2993135
Topics:
Aluminum
,
Boiling
,
Heat sinks
,
Heat
,
Fins
,
Thermal conductivity
,
Critical heat flux
,
Silicon
,
Energy dissipation
,
Heat transfer coefficients
Design for Reliability Applied to Packaging of a MOEMS Switch
J. Electron. Packag. December 2008, 130(4): 041003.
doi: https://doi.org/10.1115/1.2993142
Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
J. Electron. Packag. December 2008, 130(4): 041004.
doi: https://doi.org/10.1115/1.2993146
Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials
J. Electron. Packag. December 2008, 130(4): 041005.
doi: https://doi.org/10.1115/1.3010378
Topics:
Delamination
,
Flip-chip assemblies
,
Flow (Dynamics)
,
Thermal shock
,
Fracture (Materials)
,
Thermomechanics
,
Fatigue
Thermal Issues in Emerging Technologies Theory and Applications, THETA
Microscale and Nanoscale Thermal Characterization Techniques
J. Electron. Packag. December 2008, 130(4): 041101.
doi: https://doi.org/10.1115/1.2993145
Steady-State Behavior of a Three-Dimensional Pool-Boiling System
J. Electron. Packag. December 2008, 130(4): 041102.
doi: https://doi.org/10.1115/1.2993147
Topics:
Bifurcation
,
Boiling
,
Cooling
,
Fluids
,
Heat
,
Heat flux
,
Pool boiling
,
Steady state
,
Temperature
,
Heat transfer
An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
J. Electron. Packag. December 2008, 130(4): 041103.
doi: https://doi.org/10.1115/1.2993148
Topics:
Compressors
,
Condensers (steam plant)
,
Cooling
,
Design
,
Microchannels
,
Refrigerants
,
Refrigeration
,
Vapors
,
Compression
,
Microelectronic devices
The Thermal Design of a Next Generation Data Center: A Conceptual Exposition
J. Electron. Packag. December 2008, 130(4): 041104.
doi: https://doi.org/10.1115/1.2993151
Topics:
Data centers
,
Design
,
Cooling
,
Cooling systems
Managing Thermal Emergencies in Disk-Based Storage Systems
J. Electron. Packag. December 2008, 130(4): 041105.
doi: https://doi.org/10.1115/1.2993152
Topics:
Disks
,
Temperature
,
Emergencies
Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
J. Electron. Packag. December 2008, 130(4): 041106.
doi: https://doi.org/10.1115/1.2993126
Topics:
Copper
,
Flow (Dynamics)
,
Heat
,
Heat conduction
,
Insulation
,
Laminates
,
Modeling
,
Printed circuit boards
,
Resins
,
Temperature
Compact Thermal Models: A Global Approach
J. Electron. Packag. December 2008, 130(4): 041107.
doi: https://doi.org/10.1115/1.2993132
Topics:
Boundary-value problems
,
Cooling
,
Heat
,
Reliability
,
Temperature
,
Thermal analysis
,
Heat flux
,
Modeling
,
Resistors
,
Heat transfer
Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink
J. Electron. Packag. December 2008, 130(4): 041108.
doi: https://doi.org/10.1115/1.2993137
Topics:
Design
,
Heat
,
Heat conduction
,
Heat sinks
,
Temperature
,
Tiles
,
Genetic algorithms
Technical Briefs
Flip-Chip Interconnect for Coplanar Strip Lines
J. Electron. Packag. December 2008, 130(4): 044501.
doi: https://doi.org/10.1115/1.2993140
Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
J. Electron. Packag. December 2008, 130(4): 044502.
doi: https://doi.org/10.1115/1.3000097
Topics:
Accelerometers
,
Deformation
,
Dynamic response
,
Printed circuit boards
,
Strain gages
,
Transients (Dynamics)
,
Lumber
,
Displacement
Design Innovation
Direct Silver to Copper Bonding Process
J. Electron. Packag. December 2008, 130(4): 045001.
doi: https://doi.org/10.1115/1.2993144
Topics:
Bonding
,
Copper
,
Silver
,
Electronic packaging
,
Thermal expansion
,
Stress
,
Scanning electron microscopy
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
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