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Special Section on Therminic

J. Electron. Packag. December 2001, 123(4): 321–322. doi: https://doi.org/10.1115/1.1389845
J. Electron. Packag. December 2001, 123(4): 323–330. doi: https://doi.org/10.1115/1.1389846
J. Electron. Packag. December 2001, 123(4): 331–337. doi: https://doi.org/10.1115/1.1389847
J. Electron. Packag. December 2001, 123(4): 338–343. doi: https://doi.org/10.1115/1.1390341
J. Electron. Packag. December 2001, 123(4): 344–350. doi: https://doi.org/10.1115/1.1390342

Additional Technical Papers

J. Electron. Packag. December 2001, 123(4): 351–355. doi: https://doi.org/10.1115/1.1407825
J. Electron. Packag. December 2001, 123(4): 356–365. doi: https://doi.org/10.1115/1.1392319
J. Electron. Packag. December 2001, 123(4): 366–371. doi: https://doi.org/10.1115/1.1388562
J. Electron. Packag. December 2001, 123(4): 372–378. doi: https://doi.org/10.1115/1.1388561
J. Electron. Packag. December 2001, 123(4): 379–387. doi: https://doi.org/10.1115/1.1371927
J. Electron. Packag. December 2001, 123(4): 388–393. doi: https://doi.org/10.1115/1.1371926

Papers on Reliability

J. Electron. Packag. December 2001, 123(4): 394–400. doi: https://doi.org/10.1115/1.1372318
J. Electron. Packag. December 2001, 123(4): 401–404. doi: https://doi.org/10.1115/1.1388560

Technical Brief

J. Electron. Packag. December 2001, 123(4): 405. doi: https://doi.org/10.1115/1.1400975

Book Review

J. Electron. Packag. December 2001, 123(4): 406. doi: https://doi.org/10.1115/1.1416148
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