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Issues
June 1996
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Fatigue Crack Initiation in Solder Joints
J. Electron. Packag. June 1996, 118(2): 41–44.
doi: https://doi.org/10.1115/1.2792129
Topics:
Fatigue cracks
,
Solder joints
,
Cycles
,
Fatigue
,
Finite element methods
,
Fracture (Materials)
,
Simulation
,
Solders
,
Stress
An Experimental Technique for Studying Mixed-Mode Fatigue Crack Growth in Solder Joints
J. Electron. Packag. June 1996, 118(2): 45–48.
doi: https://doi.org/10.1115/1.2792130
Topics:
Fatigue cracks
,
Solder joints
,
Fracture (Materials)
,
Solders
,
Failure
,
Fatigue
,
Finite element analysis
,
Sands
Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints
J. Electron. Packag. June 1996, 118(2): 49–54.
doi: https://doi.org/10.1115/1.2792131
Topics:
Deformation
,
Fatigue
,
Solder joints
,
Thermomechanics
,
Cooling
,
Creep
,
Fatigue cracks
,
Fatigue life
,
Stress
,
Temperature
Solder Joint Reliability Prediction by the Integrated Matrix Creep Method
J. Electron. Packag. June 1996, 118(2): 55–61.
doi: https://doi.org/10.1115/1.2792132
Topics:
Creep
,
Reliability
,
Solder joints
,
Fatigue life
,
Design
,
Interferometry
,
Lasers
,
Modeling
,
Simulation
,
Solders
A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints
J. Electron. Packag. June 1996, 118(2): 62–66.
doi: https://doi.org/10.1115/1.2792133
Topics:
Fatigue failure
,
Solder joints
,
Tin
,
Coatings
,
Failure
,
Agglomeration (Materials)
,
Atoms
,
Cycles
,
Failure analysis
,
Melting
Energy Approach to the Fatigue of 60/40 Solder: Part II— Influence of Hold Time and Asymmetric Loading
J. Electron. Packag. June 1996, 118(2): 67–71.
doi: https://doi.org/10.1115/1.2792134
A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints
J. Electron. Packag. June 1996, 118(2): 72–79.
doi: https://doi.org/10.1115/1.2792135
Bus Bar Solder Joint Durability Evaluation
J. Electron. Packag. June 1996, 118(2): 80–86.
doi: https://doi.org/10.1115/1.2792136
Topics:
Durability
,
Solder joints
,
Damage
,
Military aircraft
,
Reliability
,
Temperature
,
Computers
,
Electronic packaging
,
Failure
,
Fatigue life
Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach
J. Electron. Packag. June 1996, 118(2): 87–93.
doi: https://doi.org/10.1115/1.2792137
Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
J. Electron. Packag. June 1996, 118(2): 94–100.
doi: https://doi.org/10.1115/1.2792138
Topics:
Experimental design
,
Solders
,
Probes
,
Printed circuit boards
,
Adhesion
,
Circuits
,
Drying
,
Electronics
,
Ovens
,
Pressure
Technical Briefs
Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards
J. Electron. Packag. June 1996, 118(2): 101–104.
doi: https://doi.org/10.1115/1.2792127
Topics:
Copper
,
Flip-chip
,
Flip-chip devices
,
Lumber
,
Shock (Mechanics)
,
Solders
,
Vibration
,
Vibration tests
,
Epoxy adhesives
,
Epoxy resins
An Empirical Crack Propagation Model and its Applications for Solder Joints
J. Electron. Packag. June 1996, 118(2): 104–107.
doi: https://doi.org/10.1115/1.2792128
Topics:
Crack propagation
,
Solder joints
,
Reliability
,
Creep
,
Fracture mechanics
,
Inspection
,
Temperature
,
Tin
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