Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging | Citedby Results | J. Electron. Packag. | ASME Digital Collection

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Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

J. Electron. Packag. Sep 2019, 141(3): 031005 (5 pages)

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