Skip to Main Content
Skip Nav Destination

Meso Scale Pulsating Jets for Electronics Cooling

J. Electron. Packag. Dec 2005, 127(4): 503-511 (9 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Sufian F. Shaker
Heat Transfer. January 2024, 53(8)
  • K. Velmurugan
  • Adarsh Shrivastav
  • Sanjeevi Bharath
  • V. P. Chandramohan
  • Karthik Balasubramanian
  • S. Karunanidhi
Journal of the Brazilian Society of Mechanical Sciences and Engineering. January 2024, 46(6)
  • Rajat Kumar
  • Dnyanesh Mirikar
  • Amit Agrawal
  • Harekrishna Yadav
International Journal of Heat and Mass Transfer. January 2024, 231
  • Dnyanesh Mirikar
  • Venugopal Arumuru
  • Harekrishna Yadav
Physics of Fluids. January 2023, 35(12)
  • R.J. Talapati
  • V.V. Katti
International Communications in Heat and Mass Transfer. January 2022, 130
  • Pawan Sharma
  • Pushpanjay K. Singh
  • Santosh K. Sahu
  • Harekrishna Yadav
Transactions of the Indian National Academy of Engineering. January 2022, 7(1)
  • Weiwei Zhao
  • Ye Jiang
  • Wenjie Yu
  • Zeqi Yu
  • Xiaoqing Liu
Small. January 2022, 18(31)
  • Muhammad Ikhlaq
  • Muhammad Yasir
  • Omidreza Ghaffari
  • Mehmet Arik
Experimental Heat Transfer. January 2022, 35(6)
  • R.J. Talapati
  • V.V. Katti
  • N.S. Hiremath
International Journal of Thermal Sciences. January 2021, 170
  • Longzhong Huang
  • Taiho Yeom
  • Terrence Simon
  • Tianhong Cui
Heat and Mass Transfer. January 2021, 57(4)
  • Taiho Yeom
  • Longzhong Huang
  • Min Zhang
  • Terrence Simon
  • Tianhong Cui
International Journal of Heat and Mass Transfer. January 2019, 143
  • Carlo Salvatore Greco
  • Gerardo Paolillo
  • Andrea Ianiro
  • Gennaro Cardone
  • Luigi de Luca
International Journal of Heat and Mass Transfer. January 2018, 117
  • Chien-Ping Wang
  • Guan-Bo Wang
  • Yung Ting
Microelectronic Engineering. January 2018, 195
  • Luis Silva-Llanca
  • Alfonso Ortega
International Journal of Thermal Sciences. January 2017, 112
  • Sunil B. Ingole
  • K. K. Sundaram
Archive of Mechanical Engineering. January 2017, 64(4)
  • C.Y.Y. Lee
  • M.L. Woyciekoski
  • J.B. Copetti
Experimental Thermal and Fluid Science. January 2016, 78
  • Omidreza Ghaffari
  • Stephen A. Solovitz
  • Mehmet Arik
International Journal of Heat and Mass Transfer. January 2016, 100
  • Alan McGuinn
  • Daniel I. Rylatt
  • Tadhg S. O’Donovan
Applied Thermal Engineering. January 2016, 103
  • M. V. Lehnen
  • C. Y. Y. Lee
  • F. L. D. Alves
Journal of the Brazilian Society of Mechanical Sciences and Engineering. January 2016, 38(7)
  • Omidreza Ghaffari
  • Stephen A. Solovitz
  • Muhammad Ikhlaq
  • Mehmet Arik
Applied Thermal Engineering. January 2016, 106
  • W.R. Marcum
  • S.R. Cadell
  • C. Ward
International Journal of Heat and Mass Transfer. January 2015, 88
  • Xin He
  • Jason A. Lustbader
  • Mehmet Arik
  • Rajdeep Sharma
International Journal of Heat and Mass Transfer. January 2015, 80
  • Omidreza Ghaffari
  • Muhammad Ikhlaq
  • Mehmet Arik
International Journal of Air-Conditioning and Refrigeration. January 2015, 23(03)
  • Luis Silva-Llanca
  • Alfonso Ortega
  • Isaac Rose
International Journal of Thermal Sciences. January 2015, 90
  • Adnan Qayoum
  • P. K. Panigrahi
Journal of Heat Transfer. January 2015, 137(12)
  • Xiao-ming Tan
  • Jing-zhou Zhang
  • Shan Yong
  • Gong-nan Xie
International Journal of Heat and Mass Transfer. January 2015, 90
  • Ashkan Haji Hosseinloo
  • Siow Pin Tan
  • Fook Fah Yap
  • Kok Chuan Toh
Applied Thermal Engineering. January 2014, 73(1)
  • Daeseok Jang
  • Kwan-Soo Lee
International Journal of Heat and Mass Transfer. January 2014, 79
  • Luis A. Silva
  • Alfonso Ortega
Journal of Heat Transfer. January 2013, 135(8)
  • Hsiu-Che Wang
  • Nels E. Jewell-Larsen
  • Alexander V. Mamishev
Applied Thermal Engineering. January 2013, 51(1-2)
  • Mangesh B. Chaudhari
  • Bhalchandra Puranik
  • Amit Agrawal
IEEE Transactions on Components, Packaging and Manufacturing Technology. January 2012, 2(3)
  • Farzad Bazdidi-Tehrani
  • Mehdi Jahromi
Journal of Dispersion Science and Technology. January 2012, 33(7)
  • Zhi Huang
  • Xinsheng Zhang
  • Ming Zhou
  • Xiaoding Xu
  • Xianzheng Zhang
  • Xuejiao Hu
Journal of Electronic Packaging. January 2012, 134(1)
  • Mehmet Arik
  • Tunc Icoz
Journal of Heat Transfer. January 2012, 134(8)
  • Charles E. Seeley
  • Yogen Utturkar
  • Mehmet Arik
  • Tunc Icoz
AIAA Journal. January 2011, 49(2)
  • Mangesh Chaudhari
  • Bhalchandra Puranik
  • Amit Agrawal
International Journal of Heat and Mass Transfer. January 2011, 54(9-10)
  • Farzad Bazdidi-Tehrani
  • Mahdi Karami
  • Mehdi Jahromi
Heat and Mass Transfer. January 2011, 47(11)
  • Bong-Min Song
  • Bongtae Han
  • Avram Bar-Cohen
  • Rajdeep Sharma
  • Mehmet Arik
IEEE Transactions on Components and Packaging Technologies. January 2010, 33(4)
  • Mangesh Chaudhari
  • Bhalchandra Puranik
  • Amit Agrawal
International Journal of Heat and Mass Transfer. January 2010, 53(5-6)
  • Mangesh Chaudhari
  • Bhalchandra Puranik
  • Amit Agrawal
Experimental Thermal and Fluid Science. January 2010, 34(2)
  • Mehmet Arik
  • Rajdeep Sharma
  • Jennifer Jackson
  • Satish Prabhakaran
  • Char Seeley
  • Yogen Utturkar
  • Stan Weaver
  • Glenn Kuenzler
  • Bongtae Han
IEEE Transactions on Components and Packaging Technologies. January 2010, 33(4)
  • Mangesh Chaudhari
  • Bhalchandra Puranik
  • Amit Agrawal
IEEE Transactions on Components and Packaging Technologies. January 2010, 33(2)
  • Mehmet Arik
  • Anant Setlur
International Journal of Energy Research. January 2010, 34(13)
  • Gopi Krishnan
  • Kamran Mohseni
European Journal of Mechanics - B/Fluids. January 2010, 29(4)
  • Yogen Utturkar
  • Mehmet Arik
  • Charles E. Seeley
  • Mustafa Gursoy
Journal of Heat Transfer. January 2008, 130(6)
  • Mehmet Arik
  • Anant Setlur
  • Stanton Weaver
  • Deborah Haitko
  • James Petroski
Journal of Electronic Packaging. January 2007, 129(3)
  • Bruno Agostini
  • Matteo Fabbri
  • Jung E. Park
  • Leszek Wojtan
  • John R. Thome
  • Bruno Michel
Heat Transfer Engineering. January 2007, 28(4)
  • A. Bar-Cohen
  • M. Arik
  • M. Ohadi
Proceedings of the IEEE. January 2006, 94(8)
Close Modal

or Create an Account

Close Modal
Close Modal