Skip Nav Destination
3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
J. Electron. Packag. Dec 2003, 125(4): 621-624 (4 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
- Yibo Ma
- Jiuyong Li
- Youxiu Wei
- Weiming Liu
- Xiaofeng Zhang
- Ziyi Fu
- Xuan Zhang
- Jingjing Peng
- Yue Yan
Ionics. January 2021, 27(8)
- Yuexing Wang
- Yao Yao
- Leon Keer
Theoretical and Applied Mechanics Letters. January 2020, 10(1)
- Seongki Ahn
- Takahiro Kadoya
- Hiroki Nara
- Tokihiko Yokoshima
- Toshiyuki Momma
- Tetsuya Osaka
Journal of Power Sources. January 2019, 437
- H. Tohmyoh
- M. Yasuda
- Masumi Saka
Scripta Materialia. January 2010, 63(3)
- Tadahiro Shibutani
- Ji Wu
- Qiang Yu
- Michael Pecht
Microelectronics Reliability. January 2008, 48(10)
- N. Settsu
- M. Saka
- F. Yamaya
Strain. January 2008, 44(2)
- Tadahiro Shibutani
- Qiang Yu
- Masaki Shiratori
- Michael G. Pecht
Microelectronics Reliability. January 2008, 48(7)
- Masumi Saka
- Fumihiko Yamaya
- Hironori Tohmyoh
Scripta Materialia. January 2007, 56(12)
- Henry Y. Lu
- Haluk Balkan
- K. Y. Simon Ng
Journal of Materials Science: Materials in Electronics. January 2006, 17(3)
- Jie-Hua Zhao
- Peng Su
- Min Ding
- Sheila Chopin
- Paul S. Ho
IEEE Transactions on Electronics Packaging Manufacturing. January 2006, 29(4)
- G.T. Galyon
IEEE Transactions on Electronics Packaging Manufacturing. January 2005, 28(1)
