Skip Nav Destination
Reliability Prediction of Area Array Solder Joints
J. Electron. Packag. Dec 2003, 125(4): 562-568 (7 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
- Jing Han
- Heng Cao
- Zhou Meng
- Xuelun Jin
- Limin Ma
- Fu Guo
- Tong An
- Ting Wang
Journal of Electronic Materials. January 2023, 52(2)
- S. Mukherjee
- B. Zhou
- A. Dasgupta
- T.R. Bieler
International Journal of Plasticity. January 2016, 78
- M. Ashraf Khan
- Quanling Zheng
- David Kopp
- Wayne Buckhanan
- Jason M. Kulick
- Patrick Fay
- Alfred M. Kriman
- Gary H. Bernstein
Journal of Electronic Packaging. January 2015, 137(2)
- F. X. Che
- John H. L. Pang
IEEE Transactions on Device and Materials Reliability. January 2013, 13(1)
- Hironori Tohmyoh
- Shoho Ishikawa
- Satoshi Watanabe
- Motohisa Kuroha
- Yoshikatsu Nakano
Microelectronics Reliability. January 2013, 53(2)
- T.R. Bieler
- L.P. Lehman
- T. Kirkpatrick
- E.J. Cotts
- B. Nandagopal
IEEE Transactions on Components and Packaging Technologies. January 2008, 31(2)
- Seungbae Park
- Ramji Dhakal
- Lawrence Lehman
- Eric J. Cotts
IEEE Transactions on Components and Packaging Technologies. January 2007, 30(1)
- H.R. Ghorbani
- J.K. Spelt
IEEE Transactions on Advanced Packaging. January 2007, 30(4)
- Christopher Bailey
- Gang Chen
- Xu Chen
Soldering & Surface Mount Technology. January 2006, 18(2)
