Skip Nav Destination
Research of Underfill Delamination in Flip Chip by the J-Integral Method
J. Electron. Packag. Mar 2004, 126(1): 94-99 (6 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
- Ephraim Suhir
- Reza Ghaffarian
Aerospace. January 2018, 5(3)
- Chang-Chun Lee
- Pal-Jen Wei
- Bow-Tsin Chian
- Chia-Hao Tsai
- Yu-Hua Dzeng
Thin Solid Films. January 2015, 584
- Chang-Chun Lee
- Yu-Lin Shen
- Yuan Kang
Materials Science in Semiconductor Processing. January 2015, 39
- Xi Liu
- Qiao Chen
- Venkatesh Sundaram
- Rao R. Tummala
- Suresh K. Sitaraman
Microelectronics Reliability. January 2013, 53(1)
- Tz-Cheng Chiu
- Chun-Hui Chen
Microelectronics Reliability. January 2012, 52(7)
- Chang-Chun Lee
- Chien-Chen Lee
- Ya-Wen Yang
Journal of Materials Science: Materials in Electronics. January 2010, 21(8)
- T.-C. Chiu
- H.-C. Lin
International Journal of Fracture. January 2009, 156(1)
- Chang-Chun Lee
- Chien-Chia Chiu
- Chin-Chiu Hsia
- Kuo-Ning Chiang
IEEE Transactions on Advanced Packaging. January 2009, 32(1)
IEEE Transactions on Advanced Packaging. January 2008, 31(1)
- Chang-Chun Lee
- Tsung-Lin Chou
- Chien-Chia Chiu
- Chin-Chiu Hsia
- Kuo-Ning Chiang
Microelectronic Engineering. January 2008, 85(10)
- L. Valdevit
- V. Khanna
- A. Sharma
- S. Sri-Jayantha
- D. Questad
- K. Sikka
Microelectronics Reliability. January 2008, 48(2)
- Cheng-fu Chen
- Pramod C. Karulkar
Journal of Electronic Packaging. January 2008, 130(3)
- C.C. Chiu
- H.H. Chang
- C.C. Lee
- C.C. Hsia
- K.N. Chiang
Microelectronics Reliability. January 2007, 47(9-11)
- Saketh Mahalingam
- Kunal Goray
- Sandeep Tonapi
- Suresh K. Sitaraman
Journal of Electronic Packaging. January 2006, 128(4)
