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Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications
J. Electron. Packag. Jun 2005, 127(2): 91-95 (5 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
- Z.W. Zhong
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Soldering & Surface Mount Technology. January 2007, 19(4)
