Skip to Main Content

Characterization of Substrate Materials for System-in-a-Package Applications

J. Electron. Packag. Jun 2004, 126(2): 195-201 (7 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Anders Andrae
  • Mengjun Xia
  • Jianli Zhang
  • Xiaoming Tang
Challenges. January 2016, 7(1)
  • Brian E. Fischer
  • Ivan J. LaHaie
  • M. D. Huang
  • M. H. A. J. Herben
  • A. C. F. Reniers
  • P. F. M. Smulders
IEEE Antennas and Propagation Magazine. January 2013, 55(6)
  • M. Franz
  • M. Weilguni
e & i Elektrotechnik und Informationstechnik. January 2011, 128(11-12)
  • Z. W. Zhong
  • T. Y. Tee
Proceedings of the IEEE. January 2009, 97(1)
  • Feng Xiang
  • Hong Wang
  • Mei Ling Zhang
  • Xi Yao
Journal of Electroceramics. January 2008, 21(1-4)
  • K. Nanbu
  • S. Ozawa
  • K. Yoshida
  • K. Saijo
  • T. Suga
IEEE Transactions on Components and Packaging Technologies. January 2005, 28(4)
Close Modal

or Create an Account

Close Modal
Close Modal