Effect of RCC on the Reliability of Adhesive Flip Chip Joints | Citedby Results | J. Electron. Packag. | ASME Digital Collection

Skip to Main Content

Skip Nav Destination

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

J. Electron. Packag. Sep 2007, 129(3): 260-265 (6 pages)

This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.

Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates

Anniina Parviainen
Kati Kokko
Laura Frisk

Microelectronics Reliability. January 2016, 56

Reliability of adhesive joined thinned chips on flexible substrates under humid conditions

Laura Frisk
Kirsi Saarinen-Pulli

Microelectronics Reliability. January 2014, 54(9-10)

Reliability of ACF Interconnections on FR-4 Substrates

L. Frisk
K. Saarinen
A. Cumini

IEEE Transactions on Components and Packaging Technologies. January 2010, 33(1)

Influence of medical sterilization on ACA flip chip joints using conformal coating

Kati Kokko
Hanna Harjunpää
Pekka Heino
Minna Kellomäki

Microelectronics Reliability. January 2009, 49(1)

Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective

Kati Kokko
Hanna Harjunpää
Anna‐Maija Haltia
Pekka Heino
Minna Kellomäki

Soldering & Surface Mount Technology. January 2009, 21(4)