Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill | Citedby Results | J. Electron. Packag. | ASME Digital Collection

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Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

J. Electron. Packag. Dec 1999, 121(4): 231-236 (6 pages)

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Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

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