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Methodology for Automated Design of Microelectronic Packages

J. Electron. Packag. Dec 1994, 116(4): 274-281 (8 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • G.W. Kim
  • K.Y. Lee
IEEE Transactions on Components and Packaging Technologies. January 2004, 27(2)
  • J. Mackerle
Finite Elements in Analysis and Design. January 2001, 37(2)
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