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Design Parameters and Practical Considerations in the Two-Phase Forced-Convection Cooling of Multi-Chip Modules
J. Electron. Packag. Sep 1992, 114(3): 280-289 (10 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
- I. Mudawar
IEEE Transactions on Components and Packaging Technologies. January 2001, 24(2)
