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Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

J. Electron. Packag. Sep 1992, 114(3): 300-304 (5 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • O. J. Ilegbusi
Journal of Electronic Packaging. January 1996, 118(4)
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