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Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

J. Electron. Packag. Jun 2008, 130(2): 021010 (7 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • P.G. Ifju
  • B. Han
Experimental Mechanics. January 2010, 50(8)
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