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A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage

J. Electron. Packag. Jun 2024, 146(2): 021006 (9 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Guoli Sun
  • Shuye Zhang
Microelectronics Reliability. January 2024, 160
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