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A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

J. Electron. Packag. Dec 2022, 144(4): 041003 (12 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
  • Wan-Chun Chuang
  • Wei-Long Chen
Materials. January 2022, 15(1)
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