Skip Nav Destination
Review of Methodologies for Structural Integrity Evaluation of Power Modules
J. Electron. Packag. Jun 2021, 143(2): 020801 (15 pages)
This article has been cited by the following articles in journals that are participating in CrossRef Cited-by Linking.
- Nobuyuki Shishido
- Yutaka Hayama
- Yuki Akinaga
- Shinya Taketomi
- Masaaki Koganemaru
- Seiya Hagihara
- Noriyuki Miyazaki
Journal of Electronic Packaging. January 2025, 147(1)
- Jiaxuan Wang
- Pan Liu
IEEE Transactions on Components, Packaging and Manufacturing Technology. January 2024, 14(8)
- Chang-Chun Lee
- Kuo-Shu Kao
- Yuan-Cheng Huang
IEEE Transactions on Power Electronics. January 2024, 39(10)
- Hiroshi Onodera
- Nobuyuki Shishido
- Daisuke Asari
- Hiroshi Isono
- Wataru Saito
Microelectronics Reliability. January 2024, 161
- Giuseppe Mauromicale
- Michele Calabretta
- Giuseppe Scarcella
- Giacomo Scelba
- Alessandro Sitta
Journal of Electronic Packaging. January 2023, 145(3)
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
- Hanyan Gao
- Pan Liu
IEEE Transactions on Components, Packaging and Manufacturing Technology. January 2022, 12(11)
- Jiuyang Tang
- Liangtao Li
- Guoqi Zhang
- Jing Zhang
- Pan Liu
Microelectronics Reliability. January 2022, 139