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Guest Editorial
Special Issue on InterPACK2023
Accepted Manuscript
Ronald Warzoha,
Ronald Warzoha
United States Naval Academy, Annapolis, MD 21402
Email: warzoha@usna.edu
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Damena Agonofer,
Damena Agonofer
University of Maryland, College Park, MD 20737
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Ashutosh Giri,
Ashutosh Giri
University of Rhode Island, Kingston, RI 02881
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Jimil Shah
Jimil Shah
Stealth Startup
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Ronald Warzoha
United States Naval Academy, Annapolis, MD 21402
Damena Agonofer
University of Maryland, College Park, MD 20737
Ashutosh Giri
University of Rhode Island, Kingston, RI 02881
Jimil Shah
Stealth Startup
Email: warzoha@usna.edu
J. Electron. Packag. 1
Published Online: September 30, 2024
Article history
Received:
September 17, 2024
Revised:
September 24, 2024
Accepted:
September 25, 2024
Published:
September 30, 2024
Citation
Warzoha, R., Agonofer, D., Giri, A., and Shah, J. (September 30, 2024). "Special Issue on InterPACK2023." ASME. J. Electron. Packag. doi: https://doi.org/10.1115/1.4066727
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