Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)

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Hsien-Chie Cheng,

Hsien-Chie Cheng

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Yan-Cheng Liu

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J. Electron. Packag. Mar 2024, 146(1): 017002 (1 pages)

Paper No: EP-23-1076 https://doi.org/10.1115/1.4063546

Published Online: October 5, 2023

An error occurred in the school affiliation address of the authors. Taichung, Taiwan 407, China is incorrect. It should be Taichung, Taiwan 407.