Abstract

Ultraviolet light-emitting diodes (UV-LEDs) have drawn considerable attentions in environment, life science, and industry fields, such as the applications of near UV-LEDs in resin curing, illumination, and identification, and deep UV-LEDs in disinfection, medical treatment, and biochemical inspection. However, due to the limitation of packaging technology, UV-LED devices exhibit low light efficiency and poor reliability compared with visible LEDs. The organic encapsulation materials are prone to UV aging, thermal degradation, and non-airtightness, which significantly reduce the performances of UV-LEDs. In order to solve this issue, UV-LED packaging technology have been proposed for UV-LED devices instead of conventional LED packaging. In this review, we detailedly investigated the overview and challenges of NUV-LED/DUV-LED packaging. For the packaging of UV-LEDs, all inorganic encapsulation materials, hermetic packaging structures with low-temperature bonding, reduced reflection losses, UV stable and transparent materials, and effective thermal management are key progresses to enhance the light efficiency and reliability of UV-LEDs. In addition, the summary and perspectives of NUV-LED/DUV-LED packaging were introduced and discussed.

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