Abstract
Structural components such as printed circuit boards (PCBs) are critical in the thermomechanical reliability assessment of electronic packages. Previous studies have shown that geometric parameters such as thickness and mechanical properties like elastic modulus of PCBs have a direct influence on the reliability of electronic packages. Elastic material properties of PCBs are commonly characterized using equipment such as tensile testers and used in computational studies. However, in certain applications viscoelastic material properties are important. Viscoelastic influence on materials is evident when one exceeds the glass transition temperature of materials. Operating conditions or manufacturing conditions such as lamination and soldering may expose components to temperatures that exceed the glass transition temperatures. Knowing the viscoelastic behavior of the different components of electronic packages is important in order to perform accurate reliability assessment and design components such as PCBs that will remain dimensionally stable after the manufacturing process. Previous researchers have used creep and stress relaxation test data to obtain the Prony series terms that represent the viscoelastic behavior and perform analysis. Others have used dynamic mechanical analysis in order to obtain frequency-domain master curves that were converted to time domain before obtaining the Prony series terms. In this paper, nonlinear solvers were used on frequency domain master curve results from dynamic mechanical analysis to obtain Prony series terms and perform finite element analysis on the impact of adding viscoelastic properties when performing reliability assessment. The computational study results were used to perform a comparative assessment to understand the impact of including viscoelastic behavior in reliability analysis under thermal cycling and drop testing for Wafer Level Chip Scale Packages.
Issue Section:
Special Papers
References
1.
Yeh
,
L.-T.
, and
Chu
,
R. C.
, 2002
, Thermal Management of Microelectronic Equipment
,
ASME Press
,
New York
.2.
Hilbert
,
W.
, and
Kube
,
F.
, 1969
, “
Effects on Electronic Equipment Reliability of Temperature Cycling in Equipment
,” Grumman Aircraft Corp., Bethpage, NY, Report No. Report No. EC-69-400
.https://apps.dtic.mil/sti/citations/AD08518843.
Engelmaier
,
W.
, 1997
, “
Solder Joints in Electronics: Design for Reliability
,” Keynotes Address in Design and Reliability of Solder and Solder Interconnectons
, Engelmaier Associates L.C., Ormond Beach, FL, pp. 9
–19
.http://analysistech.com/wpcontent/uploads/2016/04/SolderJointDesignForReliability.pdf4.
IPC Guidelines
, 1992
, “
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
,” The Institute of Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL, Report No. IPC Guidelines IPC-SM-785
.https://www.ipc.org/TOC/IPCSM-785.pdf5.
JEDEC
, 2003
, “Board Level Drop Test Method of Components for Handheld Electronic Products,” JEDEC Solid State Technology Association, Arlington, VA, Report No. JESD22-B111.6.
Hossain
,
M. M.
,
Jagarkal
,
S.
,
Agonafer
,
D.
,
Lulu
,
M.
, and
Reh
,
S.
, 2007
, “
Design Optimization and Reliability of PWB Level Electronic Package
,” ASME J. Electron. Packag.
,
129
(1
), pp. 9
–18
.10.1115/1.24297047.
B. A
,
Z.
, 2002
, “
Finite Element Based Solder Joint Fatigue Life Predictions for a Same Die Stacked Chip Scale Ball Grid Array Package
,” 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
, San Jose, CA, July 17–18, pp. 274
–284
.10.1109/IEMT.2002.10327678.
Yamada
,
S.
, 1989
, “
A Fracture Mechanics Approach to Soldered Joint Cracking
,” IEEE CHMT
,
12
(1
), pp. 99
–104
.10.1109/33.190199.
Engelmaier
,
W.
, 1984
, “
Functional Cycling and Surface Mounting Attachment Reliability
,” ISHM Technical Monograph Series, Report No. 6894-002, pp. 87
–114
.10.
Syed
,
A.
, 1995
, “
Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach
,” Trans. ASME
,
117
(2
), pp. 116
–122
.10.1115/1.279207711.
Darveaux
,
R.
,
Baneerji
,
K.
,
Mawer
,
A.
, and
Dody
,
G.
, 1995
, “
Reliability of Plastic Ball Grid Array Assembly
,” Ball Grid Array Technology
,
McGraw-Hill
,
New York
, pp. 379
–442
.12.
Liu
,
S.
, and
Liu
,
Y.
, 2011
, “
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing
,” Reliability and Testing
,
Chemical Industry Press
,
Singapore
.13.
Schubert
,
A.
,
Dudek
,
R.
,
Auerswald
,
E.
,
Golhardt
,
A.
,
Michel
,
B.
, and.,
Reichi
,
H.
, 2003
, “
Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation
,” Proceedings of 53rd Electronic Components and Technology Conference
, New Orleans, LA, May 27–30, pp. 603
–610
.10.1109/ECTC.2003.121634314.
Anand
,
L.
, 1982
, “
Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures
,” ASME J. Eng. Mater. Technol.
,
104
(1
), pp. 12
–17
.10.1115/1.322502815.
Brown
,
S.
,
Kim
,
K.
, and
Anand
,
L.
, 1989
, “
An Internal Variable Constitutive Model for Hot Working of Metals
,” Int. J. Plasticity
,
5
(2
), pp. 95
–130
.10.1016/0749-6419(89)90025-916.
Motalab
,
M.
,
Cai
,
Z.
,
Suhling
,
J. C.
, and
Lall
,
P.
, 2012
, “
Determination of Anand Constants for SAC Solders Using Stress-Strain or Creep Data
,” 13th IEEE ITHERM Conference
, San Diego, CA, May 30–June 1, pp. 910
–922
.10.1109/ITHERM.2012.623152217.
Lui
,
T. C.
, 2017
, “
Lifetime Prediction of Viscoplastic Lead-Free Solder
,” International Workshop on Integrated Power Packaging
, TU Delft, Netherlands, Apr. 5–7, pp. 1
–4
.10.1109/IWIPP.2017.793675418.
Bhate
,
D.
,
Chan
,
D.
,
Subbarayan
,
G.
,
Chiu
,
T.
,
Gupta
,
V.
, and
Edwards
,
D.
, 2008
, “
Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes
,” IEEE Trans. Compon. Packag. Technol.
,
31
(3
), pp. 622
–633
.10.1109/TCAPT.2008.200116519.
Mottahedi
,
M.
,
Dadalau
,
A.
,
Hafla
,
A.
, and
Verl
,
A.
, 2010
, “
Numerical Analysis of Relaxation Test Based on Prony Series Material Model
,” Integr. Syst., Des. Technol.
, 1389, pp. 79
–91
.https://link.springer.com/chapter/10.1007/978-3-642-17384-4_820.
Park
,
S. W.
, and
Kim
,
Y. R.
, 2001
, “
Fitting Prony-Series Viscoelastic Models With Power-Law Presmoothing
,” J. Materials Civ. Eng.
,
13
(1
), pp. 26
–32
.10.1061/(ASCE)0899-1561(2001)13:1(26)21.
Fernanda
,
M.
,
Costa
,
P.
, and
Ribeiro
,
C.
, 2011
, “
Parameter Estimation of Viscoelastic Materials: A Test Case With Different Optimization Strategies
,” AIP Conf. Proc.
,
1389
(1
), pp. 771
–774
.10.1063/1.363684622.
H. H.-T. Corporation
, 2018
, “Principle of Dynamic Mechanical Analysis (DMA),” Hitachi, Fukuoka, Japan, accessed June 20, 2018, https://www.hitachi-hightech.com/global/products/science/tech/ana/thermal/descriptions/dma.html23.
Shrotriya
,
P.
, and
Sottos
,
N. R.
, 1998
, “
Creep and Relaxation Behavior of Woven Glass/Epoxy Substrates for Multilayer Circuit Board Applications
,” Polym. Compos.
,
19
(5
), pp. 567
–578
.10.1002/pc.1013024.
Liu
,
F.
,
Meng
,
G.
, and
Zhao
,
M.
, 2007
, “
Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
,” ASME J. Electron. Packag.
,
129
(3
), pp. 266
–272
.10.1115/1.275391025.
Miller
,
C. E.
,
Gandhi
,
V.
, and
MacDonald
,
T.
, 2017
, “
Improving Reliability of Electronic Packages
,” ANSYS, Canonburg, PA.26.
Fan
,
X.
,
Varia
,
B.
, and
Han
,
Q.
, 2010
, “
Design and Optimization of Thermo-Mechanical Reliability in Wafer Level Packaging
,” Microelectron. Reliab.
,
50
(4
), pp. 536
–546
.10.1016/j.microrel.2009.11.01027.
TA Instruments
, 2020, Measurement of the Glass Transition Temperature Using Dynamic Mechanical Analysis
,
Thermal Analysis and Rheology, TA Instruments
, New Castle, DE
.28.
Hitachi High-Tech Science Corporation
, 2016
, “
Instruction Manual: DMA Master Curve Analysis
,” Thermal Analysis Software TA7000, Fukuoka, Japan, Report No. 0503-YB1-003E Ver.1.3.29.
Li
,
R.
, 2000
, “
Time-Temperature Superposition Method for Glass Transition Temperature of Plastic Materials
,” Mater. Sci. Eng. A
,
278
(1–2
), pp. 36
–45
.10.1016/S0921-5093(99)00602-430.
Lakes
,
R.
, 1998
, Viscoelastic Solids
,
CRC Press LLC
,
Boca Raton, FL
.31.
Anaskure
,
A.
, 2017
, “Effect of Viscoelastic Modeling of PCB on the Board Level Reliability of Wafer Chip Scale Package (WCSP) In Comparison to Orthotropic Linear Elastic Modeling,” M.S. thesis
, University of Texas at Arlington, Arlington, TX.http://hdl.handle.net/10106/2638432.
Misrak
,
A.
,
Anaskure
,
A.
,
Sakib
,
A.
,
Rahangdale
,
U.
,
Lohia
,
A.
, and
Agonafer
,
D.
, 2017
, “
Comparison of the Effect of Elastic and Viscoelastic Modeling of PCBs on the Assessment of Board Level Reliability
,” 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
), IEEE, Orlando, FL, May 30–June 2, pp. 1106
–1110
.10.1109/ITHERM.2017.799261233.
Reddy
,
K.
, and
Reddy
,
N. S.
, 2017
, “Comparative Study of Viscoelastic Modeling and Linear Modeling for Wafer Level Chip Scale Package Under Drop Impact,” M.S. thesis
, University of Texas at Arlington, Arlington, TX.http://hdl.handle.net/10106/2676434.
Barbero
,
E.
,
Julius
,
M.
, and
Yao
,
Z.
, 2003
, Time and Frequency Viscoelastic Behavior of Commercial Polymers
,
CCCC
,
Calabria, Italy
.35.
Mahnood
,
A.
,
Barua
,
T.
,
Sakib
,
N.
, and
Agonafer
,
D.
, 2016
, “
Impact of PCB Layer Orientation on the Drop Reliability of WCSP Boards
,” IEEE 66th Electronic Components and Technology Conference (ECTC
), Las Vegas, NV, May 31–June 3, pp. 2040
–2045
.10.1109/ECTC.2016.23636.
Rajmane
,
P.
,
Khan
,
H.
,
Doiphode
,
A.
,
Rahangdale
,
U.
,
Agonafer
,
D.
,
Lohia
,
A.
,
Kummerl
,
S.
, and
Nguyen
,
L.
, 2017
, “
Failure Mechanisms of Boards in a Thin Wafer Level Chip Scale Package
,” 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
), IEEE,
Orlando, FL
, May 27–30, pp. 703
–711
.10.1109/ITHERM.2017.799261137.
Darveaux
,
R.
, 2014
, “
Thermal Cycle Fatigue Life Prediction for Flip Chip Solder Joints
,” IEEE 64th Electronic Components and Technology Conference (ECTC
), Lake Buena Vista, FL, May 27–30, pp. 703
–711
.10.1109/ECTC.2014.689736138.
JEDEC Standard,
2009
, Temperature Cycling
,
JEDEC Solid State Technology Association
, Arlington, VA
, Report No. JESD22-A104D.39.
Darveaux
,
R.
, 1997
, “
Solder Joint Fatigue Life Model
,” Proceedings of the TMS Annual Meeting
, Orlando, FL, Feb., pp. 213
–218
.40.
Syed
,
A.
, 2001
, “
Predicting Solder Joint Reliability for Thermal, Power, & Bend Cycle Within 25% Accuracy
,” 51st ECTC
, Orlando, FL, May 29–June 1, pp. 255
–263
.10.1109/ECTC.2001.92773241.
Zhao
,
J.-H.
,
Gupta
,
V.
,
Lohia
,
A.
, and
Edwards
,
D.
, 2010
, “
Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
,” ASME J. Electron. Packag.
,
132
(1
), p. 011005
.10.1115/1.400075442.
Dhiman
,
H. S.
,
Fan
,
X.
, and
Zhou
,
T.
, 2009
, “
JEDEC Board Drop Test Simulation for Wafer Level Packages (WLPs)
,” Electronic Components and Technology Conference
, San Diego, CA, May 26–29, pp. 556
–564
.10.1109/ECTC.2009.507406843.
Luan
,
J.-E.
, and
Tee
,
T. Y.
, 2004
, “
Novel Board Level Drop Test Simulation Using Implicit Transient Analysis With Input-G Method
,” Electronics Packaging Technology Conference
, Singapore, Dec. 8–10, pp. 671
–677
.10.1109/EPTC.2004.139669344.
Kraemer
,
F.
,
Wiese
,
S.
,
Rzepka
,
S.
,
Faust
,
W.
, and
Lienig
,
J.
, 2010
, “
A Detailed Investigation of the Failure Formation of Copper Trace Cracks During Drop Tests
,” Third Electronics System Integration Technology Conference ESTC
, Berlin, Germany, Sept. 13–16, pp. 1
–6
.10.1109/ESTC.2010.5642938Copyright © 2023 by ASME
You do not currently have access to this content.
