Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue mechanism of solder joints. In this article, the majority fatigue life models are summarized, with emphasis on the latest developments in the fatigue life prediction methods. All the models reviewed are grouped into four categories based on the factors affecting the fatigue life of solder joints, which are: plastic strain-based fatigue models, creep damage-based fatigue models, energy-based fatigue models, and damage accumulation-based fatigue models. The models that do not fit any of the above categories are grouped into “other models.” Applications and potential limitations for those models are also discussed.

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