In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and silicone-repellency surfaces. To realize silicone-repellency surface, low surface energy modified nanosilica particles were prepared and deposited on the LED substrate to form porous hierarchical structure. Light efficiency enhancement for blue light COB-LEDs with pure cylindrical tuber silicone layer and white light COB-LEDs with phosphor–silicone composite layer was studied. The results show that for blue light COB-LEDs with pure cylindrical tuber silicone layer, the light efficiency increases with the contact angle and a highest light efficiency enhancement of 62.6% was achieved at 90 deg when compared to the flat silicone layer. For white light COB-LEDs at correlated color temperature (CCT) of ∼5500 K, the cylindrical tuber silicone layer enhances the light efficiency by 13.6% when compared to the conventional flat phosphor layer.
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September 2019
Research-Article
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Xingjian Yu,
Xingjian Yu
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
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Run Hu,
Run Hu
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
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Ruikang Wu,
Ruikang Wu
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
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Bin Xie,
Bin Xie
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
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Xiaoyu Zhang,
Xiaoyu Zhang
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
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Xiaobing Luo
Xiaobing Luo
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: luoxb@hust.edu.cn
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: luoxb@hust.edu.cn
1Corresponding author.
Search for other works by this author on:
Xingjian Yu
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
Run Hu
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
Ruikang Wu
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
Bin Xie
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
Xiaoyu Zhang
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
Huazhong University of Science and Technology,
Wuhan 430074, China
Xiaobing Luo
School of Energy and Power Engineering,
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: luoxb@hust.edu.cn
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: luoxb@hust.edu.cn
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 22, 2018; final manuscript received November 20, 2018; published online April 10, 2019. Assoc. Editor: Changqing Chen.
J. Electron. Packag. Sep 2019, 141(3): 031005 (5 pages)
Published Online: April 10, 2019
Article history
Received:
September 22, 2018
Revised:
November 20, 2018
Citation
Yu, X., Hu, R., Wu, R., Xie, B., Zhang, X., and Luo, X. (April 10, 2019). "Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging." ASME. J. Electron. Packag. September 2019; 141(3): 031005. https://doi.org/10.1115/1.4042982
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