There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics and impose various conditions on the information technology equipment (ITE). One common issue in HAC systems is a pressure build-up inside the HAC (known as backpressure). Backpressure also can be present in CAC systems in case of airflow imbalances. Hot air recirculation, limited cooling airflow rate in servers, and reversed flow through ITE with weaker fan systems (e.g., network switches) are some known consequences of backpressure. Currently, there is a lack of experimental data on the interdependency between overall performance of ITE and its internal design when backpressure is imposed on ITE. In this paper, three commercial 2-rack unit (RU) servers with different internal designs from various generations and performance levels are tested and analyzed under various environmental conditions. Smoke tests and thermal imaging are implemented to study the airflow patterns inside the tested equipment. In addition, the impact of hot air leakage into the servers through chassis perforations on the fan speed and the power consumption of the servers are studied. Furthermore, the cause of the discrepancy between measured inlet temperatures by the intelligent platform management interface (IPMI) and external sensors is investigated. It is found that arrangement of fans, segregation of space upstream and downstream of fans, leakage paths, the location of baseboard management controller (BMC) sensors, and the presence of backpressure can have a significant impact on ITE power and cooling efficiency.
Skip Nav Destination
Article navigation
September 2019
Research-Article
Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
Sadegh Khalili,
Sadegh Khalili
Department of Mechanical Engineering,
Binghamton University-SUNY,
Binghamton, NY 13902
Binghamton University-SUNY,
Binghamton, NY 13902
1Corresponding author.
Search for other works by this author on:
Kourosh Nemati,
Kourosh Nemati
Future Facilities, Inc.,
San Jose, CA 95110
San Jose, CA 95110
Search for other works by this author on:
Mark Seymour,
Mark Seymour
Future Facilities, Ltd.,
London SE1 7HX, UK
London SE1 7HX, UK
Search for other works by this author on:
Bahgat Sammakia
Bahgat Sammakia
Department of Mechanical Engineering,
Binghamton University-SUNY,
Binghamton, NY 13902
Binghamton University-SUNY,
Binghamton, NY 13902
Search for other works by this author on:
Sadegh Khalili
Department of Mechanical Engineering,
Binghamton University-SUNY,
Binghamton, NY 13902
Binghamton University-SUNY,
Binghamton, NY 13902
Husam Alissa
Microsoft,
Redmond, WA 98052
Redmond, WA 98052
Kourosh Nemati
Future Facilities, Inc.,
San Jose, CA 95110
San Jose, CA 95110
Mark Seymour
Future Facilities, Ltd.,
London SE1 7HX, UK
London SE1 7HX, UK
Robert Curtis
Dell,
Austin, TX 78682
Austin, TX 78682
David Moss
Dell,
Austin, TX 78682
Austin, TX 78682
Bahgat Sammakia
Department of Mechanical Engineering,
Binghamton University-SUNY,
Binghamton, NY 13902
Binghamton University-SUNY,
Binghamton, NY 13902
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 21, 2018; final manuscript received January 29, 2019; published online April 10, 2019. Assoc. Editor: Wei Li.
J. Electron. Packag. Sep 2019, 141(3): 031004 (11 pages)
Published Online: April 10, 2019
Article history
Received:
September 21, 2018
Revised:
January 29, 2019
Citation
Khalili, S., Alissa, H., Nemati, K., Seymour, M., Curtis, R., Moss, D., and Sammakia, B. (April 10, 2019). "Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design." ASME. J. Electron. Packag. September 2019; 141(3): 031004. https://doi.org/10.1115/1.4042983
Download citation file:
Get Email Alerts
Cited By
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
J. Electron. Packag (March 2025)
Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
J. Electron. Packag (December 2024)
Related Articles
Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements
J. Electron. Packag (September,2020)
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology
J. Electron. Packag (September,2022)
A Simulation-Based Approach to Data Center Thermal Efficiency Optimization
J. Eng. Sustain. Bldgs. Cities (February,2020)
Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation
J. Electron. Packag (June,2012)
Related Chapters
Fans and Air Handling Systems
Thermal Management of Telecommunications Equipment
Control and Operational Performance
Closed-Cycle Gas Turbines: Operating Experience and Future Potential
Comparison of the Availability of Trip Systems for Reactors with Exothermal Reactions (PSAM-0361)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)