Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio (FR) can however become a challenging problem for a system operating over a wide range of cooling capacities and temperature ranges. The benefits of a liquid accumulator (LA) to overcome this difficulty are evaluated in the present paper. An experimental thermosyphon cooling system was built to cool multiple electronic components up to a power dissipation of 1800 W. A double-ended cylinder with a volume of 150 cm3 is evaluated as the LA for two different system volumes (associated with two different condensers). Results demonstrated that the LA provided robust thermal performance as a function of FR for the entire range of heat loads tested. In addition, the present LA was more effective for a small volume system, 599 cm3, than for a large volume system, 1169 cm3, in which the relative size of the LA increased from 12.8% to 25% of the total system's volume.
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March 2018
Research-Article
Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
Nicolas Lamaison,
Nicolas Lamaison
Laboratory of Heat and Mass Transfer,
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
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Raffaele L. Amalfi,
Raffaele L. Amalfi
Laboratory of Heat and Mass Transfer,
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
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Todd Salamon,
Todd Salamon
Laboratory of Emerging Materials,
Components and Devices,
Nokia Bell Laboratories,
600 Mountain Avenue,
Murray Hill, NJ 07974
Components and Devices,
Nokia Bell Laboratories,
600 Mountain Avenue,
Murray Hill, NJ 07974
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Jackson B. Marcinichen,
Jackson B. Marcinichen
Laboratory of Heat and Mass Transfer,
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
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John R. Thome
John R. Thome
Laboratory of Heat and Mass Transfer,
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
e-mail: john.thome@epfl.ch
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
e-mail: john.thome@epfl.ch
Search for other works by this author on:
Nicolas Lamaison
Laboratory of Heat and Mass Transfer,
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
Raffaele L. Amalfi
Laboratory of Heat and Mass Transfer,
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
Todd Salamon
Laboratory of Emerging Materials,
Components and Devices,
Nokia Bell Laboratories,
600 Mountain Avenue,
Murray Hill, NJ 07974
Components and Devices,
Nokia Bell Laboratories,
600 Mountain Avenue,
Murray Hill, NJ 07974
Jackson B. Marcinichen
Laboratory of Heat and Mass Transfer,
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
John R. Thome
Laboratory of Heat and Mass Transfer,
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
e-mail: john.thome@epfl.ch
École Polytechnique Fédérale de Lausanne,
EPFL-STI-IGM-LTCM, Station 9,
Lausanne CH-1015, Switzerland
e-mail: john.thome@epfl.ch
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 18, 2017; final manuscript received January 3, 2018; published online March 2, 2018. Assoc. Editor: Reza Khiabani.
J. Electron. Packag. Mar 2018, 140(1): 010901 (11 pages)
Published Online: March 2, 2018
Article history
Received:
September 18, 2017
Revised:
January 3, 2018
Citation
Lamaison, N., Amalfi, R. L., Salamon, T., Marcinichen, J. B., and Thome, J. R. (March 2, 2018). "Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis." ASME. J. Electron. Packag. March 2018; 140(1): 010901. https://doi.org/10.1115/1.4039091
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