This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules (FEMs). High component density was achieved through double-side integration of substrate-embedded passives for impedance matching networks and three-dimensional (3D) double-side assembly of filters onto glass substrates. Glass with 100 μm thickness formed the core of the package, while four build-up layers with 15 μm thickness each were used to embed passives and form redistribution layers (RDLs). Advanced panel-scale double-side assembly processes were developed with low-cost mass reflow. Board-level assembly was realized with paste-printed solder balls and reflow on printed circuit board (PCB) with no intermediate substrates. Electrical performance of filters with substrate-embedded impedance matching networks was characterized and compared to simulations.

References

References
1.
Tummala
,
R. R.
, and
Laskar
,
J.
,
2004
, “
Gigabit Wireless: System-on-a-Package Technology
,”
Proc. IEEE
,
92
(
2
), pp.
376
387
.
2.
Pulsford
,
N.
,
2002
, “
Passive Integration Technology: Targeting Small, Accurate RF Parts
,”
RF Des.
,
25
(
11
), pp.
40
48
.http://defenseelectronicsmag.com/site-files/defenseelectronicsmag.com/files/archive/rfdesign.com/images/archive/1102Pulsford40.pdf
3.
Chernyakov
,
A.
,
Markov
,
K.
,
Kryshtopin
,
A.
,
Orlenko
,
D.
,
Royak
,
S.
,
Kravchenko
,
R.
,
Gordiyenko
,
A.
,
Kerssenbrock
,
T.
,
Sevskiy
,
G.
, and
Heide
,
P.
,
2004
, “
Novel Small-Size LTCC-Based WLAN Frontend-Modules With Integrated Power Amplifiers
,”
IEEE
MTT-S International Microwave Symposium Digest, Fort Worth, TX, June 6–11, Vol.
2
, pp.
559
562
.
4.
Dalmia
,
S.
,
Govind
,
V.
,
Dekosky
,
J.
,
Sundaram
,
V.
,
White
,
G.
, and
Swaminathan
,
M.
,
2006
, “
Design and Implementations of RF Systems and Sub-Systems in LCP-Type Multilayer Technology
,”
IEEE 56th Electronic Components and Technology Conference
(
ECTC
), San Diego, CA, May 30–June 2, p.
5
.
5.
Young-Joon
,
K.
,
Jae Yeong
,
P.
,
Jin-Hyung
,
R.
,
Kyeong-Hak
,
L.
, and
Jong Uk
,
B.
,
2004
, “
A Miniaturized LTCC Multi-Layered Front-End Module for Dual Band WLAN (802.11 a/b/g) Applications
,”
IEEE
MTT-S International Microwave Symposium Digest, Fort Worth, TX, June 6–11, Vol.
2
, pp.
563
566
.
6.
Souriau
,
J. C.
,
Lignier
,
O.
,
Charrier
,
M.
, and
Poupon
,
G.
,
2005
, “
Wafer Level Processing of 3D System in Package for RF and Data Application
,”
IEEE 55th Electronic Components and Technology Conference
(
ECTC
), Lake Buena Vista, FL, May 31–June 3, Vol.
1
, pp.
356
361
.
7.
Hsieh
,
C. A.
,
Tsai
,
C. H.
,
Lee
,
H. W.
,
Lee
,
T. Y.
, and
Chang
,
H.
,
2015
, “
Fan-Out Technologies for WiFi SiP Module Packaging and Electrical Performance Simulation
,”
IEEE 65th Electronic Components and Technology Conference
(
ECTC
), San Diego, CA, May 26–29, pp.
1664
1669
.
8.
Braun
,
T.
,
Töpper
,
M.
,
Becker
,
K.-F.
,
Wilke
,
M.
,
Huhn
,
M.
,
Maass
,
U.
,
Ndip
,
I.
,
Aschenbrenner
,
R.
, and
Lang
,
K.-D.
,
2016
, “
Opportunities of Fan-Out Wafer Level Packaging (FOWLP) for RF Applications
,”
IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
(
SiRF
), Austin, TX, Jan. 24–27, pp.
35
37
.
9.
Raj
,
P. M.
,
Jow
,
U. M.
,
Dai
,
J.
,
Murali
,
K. P.
,
Sharma
,
H.
,
Mishra
,
D.
,
Xiao
,
T. D.
,
Gandhi
,
S.
,
Ghovanloo
,
M.
, and
Tummala
,
R.
,
2013
, “
3D IPAC—A New Passives and Actives Concept for Ultra-Miniaturized Electronic and Bioelectronic Functional Modules
,”
IEEE 63rd Electronic Components and Technology Conference
(
ECTC
), Las Vegas, NV, May 28–31, pp.
517
522
.
10.
Dubey
,
A.
,
2008
, “
Effect of Organic Package Warpage and Assembly Challenges Using Thin Core Substrate
,”
58th Electronic Components and Technology Conference
(
ECTC
), Lake Buena Vista, FL, May 27–30, pp.
1907
1912
.
11.
Min
,
J.
,
Wu
,
Z.
,
Pulugurtha
,
M. R.
,
Smet
,
V.
,
Sundara
,
V.
,
Ravindran
,
A.
,
Hoffmann
,
C.
, and
Tummala
,
R.
,
2016
, “
Modeling Design Fabrication and Demonstration of RF Front-End Module With Ultra-Thin Glass Substrate for LTE Applications
,”
IEEE 66th Electronic Components and Technology Conference
(
ECTC
), Las Vegas, NV, May 31–June 3, pp.
1297
1302
.
12.
McCann
,
S. R.
,
Sundaram
,
V.
,
Tummala
,
R. R.
, and
Sitaraman
,
S. K.
,
2014
, “
Flip-Chip on Glass (FCOG) Package for Low Warpage
,”
IEEE 64th Electronic Components and Technology Conference
(
ECTC
), Orlando, FL, May 27–30, pp.
2189
2193
.
13.
Sawyer
,
B.
,
Suzuki
,
Y.
,
Wu
,
Z.
,
Lu
,
H.
,
Sundaram
,
V.
,
Panayappan
,
K.
, and
Tummala
,
R.
,
2015
, “
Design and Demonstration of 40 micron Bump Pitch Multi-Layer RDL on Panel-Based Glass Interposers
,”
Int. Symp. Microelectron.
,
2015
(
1
), pp.
000379
000385
.
14.
Sridharan
,
V.
,
Min
,
S.
,
Sundaram
,
V.
,
Sukumaran
,
V.
,
Hwang
,
S.
,
Chan
,
H.
,
Liu
,
F.
,
Nopper
,
C.
, and
Tummala
,
R.
,
2010
, “
Design and Fabrication of Bandpass Filters in Glass Interposer With Through-Package-Vias (TPV)
,”
IEEE 60th Electronic Components and Technology Conference
(
ECTC
), Las Vegas, NV, June 1–4, pp.
530
535
.
15.
Pieters
,
P.
,
Vaesen
,
K.
,
Brebels
,
S.
,
Mahmoud
,
S. F.
,
De Raedt
,
W.
,
Beyne
,
E.
, and
Mertens
,
R. P.
,
2001
, “
Accurate Modeling of High-Q Spiral Inductors in Thin-Film Multilayer Technology for Wireless Telecommunication Applications
,”
IEEE Trans. Microwave Theory Tech.
,
49
(
4
), pp.
589
599
.
16.
Sitaraman
,
S.
,
Min
,
J.
,
Pulugurtha
,
M. R.
,
Kim
,
M. S.
,
Sundaram
,
V.
, and
Tummala
,
R.
,
2015
, “
Modeling, Design and Demonstration of Integrated Electromagnetic Shielding for Miniaturized RF SOP Glass Packages
,”
IEEE 65th Electronic Components and Technology Conference
(
ECTC
), San Diego, CA, May 26–29, pp.
1956
1960
.
17.
Chen
,
Y. H.
,
Chien
,
C. H.
,
Hsieh
,
Y. C.
,
Lin
,
W. T.
,
Yeh
,
W. L.
,
Chen
,
C. C.
,
Tseng
,
T. J.
, and
Yun
,
H.
,
2016
, “
20″ × 20″ Panel Size Glass IPD Interposer Manufacturing
,”
IEEE 66th Electronic Components and Technology Conference
(
ECTC
), Las Vegas, NV, May 31–June 3, pp.
2146
2150
.
18.
Shorey
,
A.
,
Pollard
,
S.
,
Streltsov
,
A.
,
Piech
,
G.
, and
Wagner
,
R.
,
2012
, “
Development of Substrates for Through Glass Vias (TGV) for 3DS-IC Integration
,”
IEEE 62nd Electronic Components and Technology Conference
(
ECTC
), San Diego, CA, May 29–June 1, pp.
289
291
.
19.
Singh
,
B.
,
Huang
,
T. C.
,
Kawamoto
,
S.
,
Sundaram
,
V.
,
Pulugurtha
,
R.
,
Smet
,
V.
, and
Tummala
,
R.
,
2016
, “
Demonstration of Enhanced System-Level Reliability of Ultra-Thin BGA Packages With Circumferential Polymer Collars and Doped Solder Alloys
,”
IEEE 66th Electronic Components and Technology Conference
(
ECTC
), Las Vegas, NV, May 31–June 3, pp.
1377
1385
.
20.
McCann
,
S.
,
Singh
,
B.
,
Smet
,
V.
,
Sundaram
,
V.
,
Tummala
,
R. R.
, and
Sitaraman
,
S. K.
,
2016
, “
Process Innovations to Prevent Glass Substrate Fracture From RDL Stress and Singulation Defects
,”
IEEE Trans. Device Mater. Reliab.
,
16
(
4
), pp.
622
630
.
21.
Hoang
,
J. D. V.
,
Darveaux
,
R.
,
Lobianco
,
T.
,
Liu
,
Y.
, and
Nguyen
,
W.
,
2016
, “
Breakthrough Packaging Level Shielding Techniques and EMI Effectiveness Modeling and Characterization
,”
IEEE 66th Electronic Components and Technology Conference
(
ECTC
), Las Vegas, NV, May 31–June 3, pp.
1290
1296
.
You do not currently have access to this content.