A blister testing procedure combined with a numerical procedure can be used effectively for characterizing the adhesion strength. A challenge arises when it is implemented after subjecting samples to various environmental conditions. The concept of pseudoproperty is introduced to cope with the problem associated with property changes during environmental testing. The pseudoproperty set is determined directly from a deflection versus pressure curve obtained from a typical blister test. A classical energy balance approach is followed to evaluate the energy release rate from the critical pressure and pseudoproperty set. The proposed approach is carried out for an epoxy/copper interface after subjecting samples to full moisture saturation and a high temperature storage condition. In spite of significant change in property, the energy release rates are calculated accurately without extra tests for property measurements.

References

References
1.
Anderson
,
T. L.
,
2005
,
Fracture Mechanics: Fundamentals and Applications
,
CRC Press
,
New York
.
2.
Hencky
,
H.
,
1915
, “
Uberden Spannungszustand in kreisunden Platten mit Verschwindende
,”
Zr. Math. Phys.
,
63
, pp.
311
317
.
3.
Dannenberg
,
H.
,
1961
, “
Measurement of Adhesion by a Blister Method
,”
J. Appl. Polym. Sci.
,
5
(
14
), pp.
125
134
.
4.
Williams
,
M. L.
,
1969
, “
The Continuum Interpretation for Fracture and Adhesion
,”
J. Appl. Polym. Sci.
,
13
(
1
), pp.
29
40
.
5.
Hinkley
,
J. A.
,
1983
, “
A Blister Test for Adhesion of Polymer Films to SiO2
,”
Adhesion
,
16
(
2
), pp.
115
126
.
6.
Gent
,
A. N.
, and
Lewandowski
,
L. H.
,
1987
, “
Blow-Off Pressures for Adhering Layers
,”
J. Appl. Polym. Sci.
,
33
(
5
), pp.
1567
1577
.
7.
Sikorski
,
S. A.
,
1994
, “
Measurement of Adhesion Using the Island Blister Test
,”
Ph.D. dissertation
, Mechanical Engineering, MIT, Cambridge, MA.
8.
Hohlfelder
,
R. J.
,
Vlassak
,
J.
,
Nixa
,
W.
,
Luo
,
H.
, and
Chidsey
,
C.
,
1995
, “
Blister Test Analysis Methods
,”
MRS Proc.
,
356
, pp.
585
590
.
9.
Lai
,
Y.-H.
, and
Dillard
,
D. A.
,
1995
, “
A Study of the Fracture Efficiency Parameter of Blister Tests for Films and Coatings
,”
Adhesion Measurement of Films and Coatings
,
K. L.
Mittal
, ed.,
VSP
,
Utrecht, The Netherlands
.
10.
Bagchi
,
A.
, and
Evans
,
A. G.
,
1996
, “
The Mechanics and Physics of Thin Film Decohesion and Its Measurements
,”
Interface Sci.
,
3
(
3
), pp.
169
193
.
11.
Hbaieb
,
K.
, and
Zhang
,
Y. W.
,
2005
, “
A Parametric Study of a Pressurized Blister Test for an Elastic-Plastic Film-Rigid Substrate System
,”
Mater. Sci. Eng., A
,
390
(
1–2
), pp.
385
392
.
12.
Mahan
,
K.
,
Sun
,
Y.
,
Han
,
B.
,
Han
,
S.
, and
Osterman
,
M.
,
2014
, “
Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth
,”
ASME J. Electron. Packag.
,
136
(
3
), p.
031004
.
13.
Chan
,
E. K. L.
,
Fan
,
H.
, and
Yuen
,
M.
,
2006
, “
Effect of Interfacial Adhesion of Copper/Epoxy Under Different Moisture Level
,”
7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
, 2006
EuroSimE
, Como, Italy, Apr. 24–26.
14.
Ferguson
,
T. P.
,
2004
, “
Moisture and Interfacial Adhesion in Microelectronic Assemblies
,”
Ph.D. thesis
, Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA.
15.
Ferguson
,
T. P.
, and
Qu
,
J.
,
2007
, “
The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging
,”
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
,
E.
Suhir
,
Y. C.
Lee
, and
C. P.
Wong
, eds.,
Springer
,
New York
.
16.
Park
,
Y. B.
, and
Yu
,
J.
,
1997
, “
A Fracture Mechanics Analysis of the Popcorn Cracking in the Plastic IC Packages
,”
21st IEEE/CPMT
International Electronics Manufacturing Technology Symposium
, Austin, TX, Oct. 13–15, pp.
12
19
.
17.
Lin
,
C.
,
Suhling
,
J.
, and
Lall
,
P.
,
2009
, “
Isothermal Aging Induced Evolution of the Material Behavior of Underfill Encapsulants
,”
59th Electronic Components and Technology Conference
(
ECTC 2009
), San Diego, CA, May 26–29, pp.
134
149
.
18.
Noijen
,
S.
,
Engelen
,
R.
,
Martens
,
J.
,
Opran
,
A.
, and
Sluis
,
O.
,
2009
, “
On the Epoxy Moulding Compound Aging Effect on Package Reliability
,”
Tenth International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
(
EuroSimE 2009
), Delft, The Netherlands, Apr. 26–29.
19.
Emri
,
I.
,
2005
, “
Rheology of Solid Polymers
,”
Rheol. Rev.
,
2005
, p.
49
.
20.
Shia
,
X. Q.
,
Wang
,
Z. P.
,
Pang
,
H. L.
, and
Zhang
,
X. R.
,
2002
, “
Investigation of Effect of Temperature and Strain Rate on Mechanical Properties of Underfill Material by Use of Microtensile Specimens
,”
Polym. Test.
,
21
(
6
), pp.
725
733
.
21.
Sun
,
Y.
,
Wang
,
Y.
,
Jang
,
C.
,
Han
,
B.
, and
Choi
,
K. Y.
,
2013
, “
Generalized Hybrid Modeling to Determine Chemical Shrinkage and Modulus Evolutions at Arbitrary Temperatures
,”
Exp. Mech.
,
53
(
9
), pp.
1783
1790
.
22.
Briscoe
,
B. J.
, and
Penesar
,
S. S.
,
1991
, “
The Application of the Blister Test to an Elastomeric Adhesive
,”
Proc. R. Soc. London, Ser. A
,
433
(
1887
), pp.
23
43
.
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