Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient hot-wire method, laser flash diffusivity method, and transient plane source (TPS) method are most used. For thin film measurement, the 3ω method and the transient thermoreflectance technique including both time-domain and frequency-domain analysis are widely employed. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interfacial thermal conductance with less than 5% error. Selecting a specific measurement technique to characterize thermal properties needs to be based on: (1) knowledge on the sample whose thermophysical properties are to be determined, including the sample geometry and size, and the material preparation method; (2) understanding of fundamentals and procedures of the testing technique, for example, some techniques are limited to samples with specific geometries and some are limited to a specific range of thermophysical properties; and (3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.
Issue Section:
Review Article
Keywords:
Thermal analysis
References
1.
Savija
, I.
, Culham
, J. R.
, Yovanovich
, M. M.
, and Marotta
, E. E.
, 2003
, “Review of Thermal Conductance Models for Joints Incorporating Enhancement Materials
,” J. Thermophys. Heat Transfer.
, 17
(1
), pp. 43
–52
.2.
Pollack
, G. L.
, 1969
, “Kapitza Resistance
,” Rev. Mod. Phys.
, 41
(1
), pp. 48
–81
.3.
Tritt
, T. M.
, and Weston
, D.
, 2004
, “Measurement Techniques and Considerations for Determining Thermal Conductivity of Bulk Materials
,” Thermal Conductivity
, T. M.
Tritt
, ed., Springer
, New York, pp. 187
–203
.4.
Hamilton
, R. L.
, and Crosser
, O. K.
, 1962
, “Thermal Conductivity of Heterogeneous Two-Component Systems
,” Ind. Eng. Chem. Fundam.
, 1
(3
), pp. 187
–191
.5.
Zeller
, R. C.
, and Pohl
, R. O.
, 1971
, “Thermal Conductivity and Specific Heat of Noncrystalline Solids
,” Phys. Rev. B
, 4
(6
), pp. 2029
–2041
.6.
Cooper
, M. G.
, Mikic
, B. B.
, and Yovanovich
, M. M.
, 1969
, “Thermal Contact Conductance
,” Int. J. Heat Mass Transfer
, 12
(3
), pp. 279
–300
.7.
Madhusudana
, C. V.
, and Fletcher
, L. S.
, 1986
, “Contact Heat Transfer: The Last Decade
,” AIAA J.
, 24
(3
), pp. 510
–523
.8.
Prasher
, R.
, 2006
, “Thermal Interface Materials: Historical Perspective, Status, and Future Directions
,” Proc. IEEE
, 94
(8
), pp. 1571
–1586
.9.
Machlin
, E. S.
, 2006
, Materials Science in Microelectronics: The Relationships Between Thin Film Processing and Structure
, Cambridge University Press
, New York,10.
Peumans
, P.
, Yakimov
, A.
, and Forrest
, S. R.
, 2003
, “Small Molecular Weight Organic Thin-Film Photodetectors and Solar Cells
,” J. Appl. Phys.
, 93
(7
), pp. 3693
–3723
.11.
Xi
, J.-Q.
, Schubert
, M. F.
, Kim
, J. K.
, Schubert
, E. F.
, Chen
, M.
, Lin
, S.-Y.
, Liu
, W.
, and Smart
, J. A.
, 2007
, “Optical Thin-Film Materials With Low Refractive Index for Broadband Elimination of Fresnel Reflection
,” Nat. Photonics
, 1
(3
), pp. 176
–179
.12.
Dresselhaus
, M. S.
, Chen
, G.
, Tang
, M. Y.
, Yang
, R. G.
, Lee
, H.
, Wang
, D. Z.
, Ren
, Z. F.
, Fleurial
, J.-P.
, and Gogna
, P.
, 2007
, “New Directions for Low-Dimensional Thermoelectric Materials
,” Adv. Mater.
, 19
(8
), pp. 1043
–1053
.13.
Borca-Tasciuc
, T.
, Kumar
, A. R.
, and Chen
, G.
, 2001
, “Data Reduction in 3ω Method for Thin-Film Thermal Conductivity Determination
,” Rev. Sci. Instrum.
, 72
(4
), pp. 2139
–2147
.14.
Cahill
, D. G.
, Goodson
, K.
, and Majumdar
, A.
, 2002
, “Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
,” ASME J. Heat Transfer
, 124
(2
), pp. 223
–241
.15.
Borca-Tasciuc
, T.
, and Chen
, G.
, 2004
, “Experimental Techniques for Thin-Film Thermal Conductivity Characterization
,” Thermal Conductivity
, T. M.
Tritt
, ed., Springer
, New York, pp. 205
–237
.16.
Cahill
, D. G.
, Braun
, P. V.
, Chen
, G.
, Clarke
, D. R.
, Fan
, S.
, Goodson
, K. E.
, Keblinski
, P.
, King
, W. P.
, Mahan
, G. D.
, Majumdar
, A.
, Maris
, H. J.
, Phillpot
, S. R.
, Pop
, E.
, and Shi
, L.
, 2014
, “Nanoscale Thermal Transport—II: 2003–2012
,” Appl. Phys. Rev.
, 1
(1
), p. 11305
.17.
Shi
, L.
, Dames
, C.
, Lukes
, J. R.
, Reddy
, P.
, Duda
, J.
, Cahill
, D. G.
, Lee
, J.
, Marconnet
, A.
, Goodson
, K. E.
, Bahk
, J.-H.
, Shakouri
, A.
, Prasher
, R. S.
, Felts
, J.
, King
, W. P.
, Han
, B.
, and Bischof
, J. C.
, 2015
, “Evaluating Broader Impacts of Nanoscale Thermal Transport Research
,” Nanoscale Microscale Thermophys. Eng.
, 19
(2
), pp. 127
–165
.18.
Marconnet
, A. M.
, Panzer
, M. A.
, and Goodson
, K. E.
, 2013
, “Thermal Conduction Phenomena in Carbon Nanotubes and Related Nanostructured Materials
,” Rev. Mod. Phys.
, 85
(3
), pp. 1295
–1326
.19.
Toberer
, E. S.
, Baranowski
, L. L.
, and Dames
, C.
, 2012
, “Advances in Thermal Conductivity
,” Annu. Rev. Mater. Res.
, 42
(1
), pp. 179
–209
.20.
ASTM
, 2013, “Standard Test Method for Steady-State Heat Flux Measurements and Thermal Transmission Properties by Means of the Guarded-Hot-Plate Apparatus
,” ASTM International, West Conshohocken, PA, Standard No. ASTM C177-13.21.
Pope
, A. L.
, Zawilski
, B.
, and Tritt
, T. M.
, 2001
, “Description of Removable Sample Mount Apparatus for Rapid Thermal Conductivity Measurements
,” Cryogenics
, 41
(10
), pp. 725
–731
.22.
EN
, 2011, “Thermal Performance of Building Materials and Products: Determination of Thermal Resistance by Means of Guarded Hot Plate and Heat Flow Meter Methods—Products of High and Medium Thermal Resistance
,” European Standard, London, Standard No. EN 12667:2001.23.
ISO
, 1991, “Thermal Insulation: Determination of Steady-State Thermal Resistance and Related Properties—Guarded Hot Plate Apparatus
,” International Organization for Standardization, New York, Standard No. ISO 8302:1991.24.
Shi
, L.
, Li
, D.
, Yu
, C.
, Jang
, W.
, Kim
, D.
, Yao
, Z.
, Kim
, P.
, and Majumdar
, A.
, 2003
, “Measuring Thermal and Thermoelectric Properties of One-Dimensional Nanostructures Using a Microfabricated Device
,” ASME J. Heat Transfer
, 125
(5
), pp. 881
–888
.25.
Stojanovic
, N.
, Berg
, J. M.
, Maithripala
, D. H. S.
, and Holtz
, M.
, 2009
, “Direct Measurement of Thermal Conductivity of Aluminum Nanowires
,” Appl. Phys. Lett.
, 95
(9
), p. 91905
.26.
Marconnet
, A. M.
, Yamamoto
, N.
, Panzer
, M. A.
, Wardle
, B. L.
, and Goodson
, K. E.
, 2011
, “Thermal Conduction in Aligned Carbon Nanotube–Polymer Nanocomposites With High Packing Density
,” ACS Nano
, 5
(6
), pp. 4818
–4825
.27.
Zhang
, X.
, Cong
, P. Z.
, and Fujii
, M.
, 2006
, “A Study on Thermal Contact Resistance at the Interface of Two Solids
,” Int. J. Thermophys.
, 27
(3
), pp. 880
–895
.28.
Shahil
, K. M.
, and Balandin
, A. A.
, 2012
, “Thermal Properties of Graphene and Multilayer Graphene: Applications in Thermal Interface Materials
,” Solid State Commun.
, 152
(15
), pp. 1331
–1340
.29.
ASTM
, 2012, “Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials
,” ASTM International, West Conshohocken, PA, Standard No. ASTM D5470-12.30.
ASTM
, 2013, “Standard Test Method for Thermal Conductivity of Solids Using the Guarded-Comparative-Longitudinal Heat Flow Technique
,” ASTM International, West Conshohocken, PA, Standard No. ASTM E1225-13.31.
ASTM
, 2015, “Standard Test Method for Steady-State Thermal Transmission Properties by Means of the Heat Flow Meter Apparatus
,” ASTM International, West Conshohocken, PA, Standard No. ASTM C518-15.32.
ASTM
, 2011, “Standard Test Method for Evaluating the Resistance to Thermal Transmission of Materials by the Guarded Heat Flow Meter Technique
,” ASTM International, West Conshohocken, PA, Standard No. ASTM E1530-11.33.
Flynn
, D. R.
, 1992
, “Thermal Conductivity of Loose-Fill Materials by a Radial-Heat-Flow Method
,” Compendium of Thermophysical Property Measurement Methods
, K. D.
Maglić
, A.
Cezairliyan
, and V. E.
Peletsky
, eds., Springer
, New York, pp. 33
–75
.34.
ASTM
, 2010, “Standard Test Method for Steady-State Heat Transfer Properties of Pipe Insulation
,” ASTM International, West Conshohocken, PA, Standard No. ASTM C335/C335M-10.35.
ISO
, 1994, “Thermal Insulation: Determination of Steady-State Thermal Transmission Properties of Thermal Insulation of Circular Pipes
,” International Organization for Standardization, New York, Standard No. ISO 8497:1994
.36.
Zawilski
, B. M.
, Iv
, R. T. L.
, and Tritt
, T. M.
, 2001
, “Description of the Parallel Thermal Conductance Technique for the Measurement of the Thermal Conductivity of Small Diameter Samples
,” Rev. Sci. Instrum.
, 72
(3
), pp. 1770
–1774
.37.
Dasgupta
, T.
, and Umarji
, A. M.
, 2007
, “Thermal Properties of MoSi2 With Minor Aluminum Substitutions
,” Intermetallics
, 15
(2
), pp. 128
–132
.38.
Maldonado
, O.
, 1992
, “Pulse Method for Simultaneous Measurement of Electric Thermopower and Heat Conductivity at Low Temperatures
,” Cryogenics
, 32
(10
), pp. 908
–912
.39.
Sundqvist
, B.
, 1991
, “Thermal Diffusivity Measurements by Angstrom's Method in a Fluid Environment
,” Int. J. Thermophys.
, 12
(1
), pp. 191
–206
.40.
Angstrom
, A. J.
, 1863
, “New Method of Determining the Conductibility of Bodies
,” Philos. Mag.
, 25
, p. 130
.41.
Romao
, C. P.
, Miller
, K. J.
, Johnson
, M. B.
, Zwanziger
, J. W.
, Marinkovic
, B. A.
, and White
, M. A.
, 2014
, “Thermal, Vibrational, and Thermoelastic Properties of Y2Mo3O12 and Their Relations to Negative Thermal Expansion
,” Phys. Rev. B
, 90
(2
), p. 24305
.42.
Miller
, K. J.
, Johnson
, M. B.
, White
, M. A.
, and Marinkovic
, B. A.
, 2012
, “Low-Temperature Investigations of the Open-Framework Material HfMgMo3O12
,” Solid State Commun.
, 152
(18
), pp. 1748
–1752
.43.
Kennedy
, C. A.
, and White
, M. A.
, 2005
, “Unusual Thermal Conductivity of the Negative Thermal Expansion Material, ZrW2O8
,” Solid State Commun.
, 134
(4
), pp. 271
–276
.44.
Whitman
, C. A.
, Johnson
, M. B.
, and White
, M. A.
, 2012
, “Characterization of Thermal Performance of a Solid–Solid Phase Change Material, Di-n-Hexylammonium Bromide, for Potential Integration in Building Materials
,” Thermochim. Acta
, 531
, pp. 54
–59
.45.
Stalhane
, B.
, and Pyk
, S.
, 1931
, “New Method for Determining the Coefficients of Thermal Conductivity
,” Tek. Tidskr.
, 61
(28
), pp. 389
–393
.46.
Abu-Hamdeh
, N. H.
, Khdair
, A. I.
, and Reeder
, R. C.
, 2001
, “A Comparison of Two Methods Used to Evaluate Thermal Conductivity for Some Soils
,” Int. J. Heat Mass Transfer
, 44
(5
), pp. 1073
–1078
.47.
Festa
, C.
, and Rossi
, A.
, 1999
, “Apparatus for Routine Measurements of the Thermal Conductivity of Ice Cores
,” Ann. Glaciol.
, 29
(1
), pp. 151
–154
.48.
ASTM
, 2009, “Standard Test Method for Thermal Conductivity of Refractories by Hot Wire (Platinum Resistance Thermometer Technique)
,” ASTM International, West Conshohocken, PA, Standard No. ASTM C1113/C1113M-09.49.
ISO
, 2010, “Refractory materials—Determination of Thermal Conductivity—Part 1: Hot-Wire Methods (Cross-Array and Resistance Thermometer)
,” International Organization for Standardization, New York, Standard No. ISO 8894-1:2010.50.
Franco
, A.
, 2007
, “An Apparatus for the Routine Measurement of Thermal Conductivity of Materials for Building Application Based on a Transient Hot-Wire Method
,” Appl. Therm. Eng.
, 27
(14–15
), pp. 2495
–2504
.51.
Assael
, M. J.
, Antoniadis
, K. D.
, and Wakeham
, W. A.
, 2010
, “Historical Evolution of the Transient Hot-Wire Technique
,” Int. J. Thermophys.
, 31
(6
), pp. 1051
–1072
.52.
Assael
, M. J.
, Antoniadis
, K. D.
, Metaxa
, I. N.
, Mylona
, S. K.
, Assael
, J.-A. M.
, Wu
, J.
, and Hu
, M.
, 2015
, “A Novel Portable Absolute Transient Hot-Wire Instrument for the Measurement of the Thermal Conductivity of Solids
,” Int. J. Thermophys.
, 36
(10–11
), pp. 3083
–3105
.53.
Tong
, X. C.
, 2011
, “Characterization Methodologies of Thermal Management Materials
,” Advanced Materials for Thermal Management of Electronic Packaging
, Springer
, New York
, pp. 59
–129
.54.
ASTM
, 2009, “Standard Test Method for Thermal Conductivity of Plastics by Means of a Transient Line-Source Technique
,” ASTM International, West Conshohocken, PA, Standard No. ASTM D5930-09.55.
ASTM
, 2014, “Standard Test Method for Determination of Thermal Conductivity of Soil and Soft Rock by Thermal Needle Probe Procedure
,” ASTM International, West Conshohocken, PA, Standard No. ASTM D5334-14.56.
Gong
, L.
, Wang
, Y.
, Cheng
, X.
, Zhang
, R.
, and Zhang
, H.
, 2013
, “Porous Mullite Ceramics With Low Thermal Conductivity Prepared by Foaming and Starch Consolidation
,” J. Porous Mater.
, 21
(1
), pp. 15
–21
.57.
ASTM
, 2016, “Standard Test Method for Measurement of Thermal Effusivity of Fabrics Using a Modified Transient Plane Source (MTPS) Instrument
,” ASTM International, West Conshohocken, PA, Standard No. ASTM D7984-16.58.
Bouguerra
, A.
, Aït-Mokhtar
, A.
, Amiri
, O.
, and Diop
, M. B.
, 2001
, “Measurement of Thermal Conductivity, Thermal Diffusivity and Heat Capacity of Highly Porous Building Materials Using Transient Plane Source Technique
,” Int. Commun. Heat Mass Transfer
, 28
(8
), pp. 1065
–1078
.59.
Gustafsson
, S. E.
, 1991
, “Transient Plane Source Techniques for Thermal Conductivity and Thermal Diffusivity Measurements of Solid Materials
,” Rev. Sci. Instrum.
, 62
(3
), pp. 797
–804
.60.
Gustavsson
, M.
, Karawacki
, E.
, and Gustafsson
, S. E.
, 1994
, “Thermal Conductivity, Thermal Diffusivity, and Specific Heat of Thin Samples From Transient Measurements With Hot Disk Sensors
,” Rev. Sci. Instrum.
, 65
(12
), pp. 3856
–3859
.61.
He
, Y.
, 2005
, “Rapid Thermal Conductivity Measurement With a Hot Disk Sensor—Part 1: Theoretical Considerations
,” Thermochim. Acta
, 436
(1–2
), pp. 122
–129
.62.
Li
, Y.
, Shi
, C.
, Liu
, J.
, Liu
, E.
, Shao
, J.
, Chen
, Z.
, Dorantes-Gonzalez
, D. J.
, and Hu
, X.
, 2014
, “Improving the Accuracy of the Transient Plane Source Method by Correcting Probe Heat Capacity and Resistance Influences
,” Meas. Sci. Technol.
, 25
(1
), p. 15006
.63.
ISO
, 2015, “Plastics—Determination of Thermal Conductivity and Thermal Diffusivity—Part 2: Transient Plane Heat Source (Hot Disc) Method
,” International Organization for Standardization, New York, Standard No. ISO 22007-2:2015.64.
Afriyie
, E. T.
, Karami
, P.
, Norberg
, P.
, and Gudmundsson
, K.
, 2014
, “Textural and Thermal Conductivity Properties of a Low Density Mesoporous Silica Material
,” Energy Build.
, 75
, pp. 210
–215
.65.
Min
, S.
, Blumm
, J.
, and Lindemann
, A.
, 2007
, “A New Laser Flash System for Measurement of the Thermophysical Properties
,” Thermochim. Acta
, 455
(1–2
), pp. 46
–49
.66.
Parker
, W. J.
, Jenkins
, R. J.
, Butler
, C. P.
, and Abbott
, G. L.
, 1961
, “Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
,” J. Appl. Phys.
, 32
(9
), pp. 1679
–1684
.67.
Campbell
, R. C.
, Smith
, S. E.
, and Dietz
, R. L.
, 1999
, “Measurements of Adhesive Bondline Effective Thermal Conductivity and Thermal Resistance Using the Laser Flash Method
,” Fifteenth Annual IEEE
Semiconductor Thermal Measurement and Management Symposium
, Mar. 9–11, pp. 83
–97
.68.
Ruoho
, M.
, Valset
, K.
, Finstad
, T.
, and Tittonen
, I.
, 2015
, “Measurement of Thin Film Thermal Conductivity Using the Laser Flash Method
,” Nanotechnology
, 26
(19
), p. 195706
.69.
ASTM
, 2013, “Standard Test Method for Thermal Diffusivity by the Flash Method
,” ASTM International, West Conshohocken, PA, Standard No. ASTM E1461-13.70.
ISO
, 2008, “Plastics—Determination of Thermal Conductivity and Thermal Diffusivity—Part 4: Laser Flash Method
,” International Organization for Standardization, New York, Standard No. ISO 22007-4:2008.71.
Abdulagatov
, I. M.
, Abdulagatova
, Z. Z.
, Kallaev
, S. N.
, Bakmaev
, A. G.
, and Ranjith
, P. G.
, 2015
, “Thermal-Diffusivity and Heat-Capacity Measurements of Sandstone at High Temperatures Using Laser Flash and DSC Methods
,” Int. J. Thermophys.
, 36
(4
), pp. 658
–691
.72.
Khuu
, V.
, Osterman
, M.
, Bar-Cohen
, A.
, and Pecht
, M.
, 2011
, “Considerations in the Use of the Laser Flash Method for Thermal Measurements of Thermal Interface Materials
,” IEEE Trans. Compon. Packag. Manuf. Technol.
, 1
(7
), pp. 1015
–1028
.73.
Völklein
, F.
, Reith
, H.
, and Meier
, A.
, 2013
, “Measuring Methods for the Investigation of In-Plane and Cross-Plane Thermal Conductivity of Thin Films
,” Phys. Status Solidi A
, 210
(1
), pp. 106
–118
.74.
Lee
, J.
, Li
, Z.
, Reifenberg
, J. P.
, Lee
, S.
, Sinclair
, R.
, Asheghi
, M.
, and Goodson
, K. E.
, 2011
, “Thermal Conductivity Anisotropy and Grain Structure in Ge2Sb2Te5 Films
,” J. Appl. Phys.
, 109
(8
), p. 84902
.75.
Völklein
, F.
, 1990
, “Thermal Conductivity and Diffusivity of a Thin Film SiO2-Si3N4 Sandwich System
,” Thin Solid Films
, 188
(1
), pp. 27
–33
.76.
Volklein
, F.
, and Starz
, T.
, 1997
, “Thermal Conductivity of Thin Films: Experimental Methods and Theoretical Interpretation
,” XVI International Conference on Thermoelectrics
(ICT’97
), Aug. 26–29, pp. 711
–718
.77.
Cahill
, D. G.
, Fischer
, H. E.
, Klitsner
, T.
, Swartz
, E. T.
, and Pohl
, R. O.
, 1989
, “Thermal Conductivity of Thin Films: Measurements and Understanding
,” J. Vac. Sci. Technol. A
, 7
(3
), pp. 1259
–1266
.78.
Cahill
, D. G.
, 1990
, “Thermal Conductivity Measurement From 30 to 750 K: The 3ω Method
,” Rev. Sci. Instrum.
, 61
(2
), pp. 802
–808
.79.
Feser
, J. P.
, Chan
, E. M.
, Majumdar
, A.
, Segalman
, R. A.
, and Urban
, J. J.
, 2013
, “Ultralow Thermal Conductivity in Polycrystalline CdSe Thin Films With Controlled Grain Size
,” Nano Lett.
, 13
(5
), pp. 2122
–2127
.80.
Bourlon
, A. B.
, and Van der Tempel
, L.
, 2006
, “Thermal Conductivity Measurement by the 3 Omega Method
,” Philips Electronics, Koninklijke, Amsterdam, The Netherlands, Technical Note PRTN 2005/01035
.81.
Dames
, C.
, 2013
, “Measuring the Thermal Conductivity of Thin Films: 3 Omega and Related Electrothermal Methods
,” Annu. Rev. Heat Transfer
, 16
(16
), pp. 7–49.82.
Cahill
, D. G.
, Ford
, W. K.
, Goodson
, K. E.
, Mahan
, G. D.
, Majumdar
, A.
, Maris
, H. J.
, Merlin
, R.
, and Phillpot
, S. R.
, 2003
, “Nanoscale Thermal Transport
,” J. Appl. Phys.
, 93
(2
), pp. 793
–818
.83.
Mishra
, V.
, Hardin
, C. L.
, Garay
, J. E.
, and Dames
, C.
, 2015
, “A 3 Omega Method to Measure an Arbitrary Anisotropic Thermal Conductivity Tensor
,” Rev. Sci. Instrum.
, 86
(5
), p. 54902
.84.
Cahill
, D. G.
, and Pohl
, R. O.
, 1987
, “Thermal Conductivity of Amorphous Solids Above the Plateau
,” Phys. Rev. B
, 35
(8
), pp. 4067
–4073
.85.
Roy-Panzer
, S.
, Kodama
, T.
, Lingamneni
, S.
, Panzer
, M. A.
, Asheghi
, M.
, and Goodson
, K. E.
, 2015
, “Thermal Characterization and Analysis of Microliter Liquid Volumes Using the Three-Omega Method
,” Rev. Sci. Instrum.
, 86
(2
), p. 24901
.86.
Rosencwaig
, A.
, 1982
, “Thermal-Wave Imaging
,” Science
, 218
(4569
), pp. 223
–228
.87.
Rosencwaig
, A.
, and Gersho
, A.
, 1976
, “Theory of the Photoacoustic Effect With Solids
,” J. Appl. Phys.
, 47
(1
), pp. 64
–69
.88.
Eesley
, G. L.
, 1983
, “Observation of Nonequilibrium Electron Heating in Copper
,” Phys. Rev. Lett.
, 51
(23
), pp. 2140
–2143
.89.
Wilson
, R. B.
, Feser
, J. P.
, Hohensee
, G. T.
, and Cahill
, D. G.
, 2013
, “Two-Channel Model for Nonequilibrium Thermal Transport in Pump-Probe Experiments
,” Phys. Rev. B
, 88
(14
), p. 144305
.90.
Wright
, O. B.
, and Kawashima
, K.
, 1992
, “Coherent Phonon Detection From Ultrafast Surface Vibrations
,” Phys. Rev. Lett.
, 69
(11
), pp. 1668
–1671
.91.
Luckyanova
, M. N.
, Garg
, J.
, Esfarjani
, K.
, Jandl
, A.
, Bulsara
, M. T.
, Schmidt
, A. J.
, Minnich
, A. J.
, Chen
, S.
, Dresselhaus
, M. S.
, Ren
, Z.
, Fitzgerald
, E. A.
, and Chen
, G.
, 2012
, “Coherent Phonon Heat Conduction in Superlattices
,” Science
, 338
(6109
), pp. 936
–939
.92.
Ravichandran
, J.
, Yadav
, A. K.
, Cheaito
, R.
, Rossen
, P. B.
, Soukiassian
, A.
, Suresha
, S. J.
, Duda
, J. C.
, Foley
, B. M.
, Lee
, C.-H.
, Zhu
, Y.
, Lichtenberger
, A. W.
, Moore
, J. E.
, Muller
, D. A.
, Schlom
, D. G.
, Hopkins
, P. E.
, Majumdar
, A.
, Ramesh
, R.
, and Zurbuchen
, M. A.
, 2014
, “Crossover From Incoherent to Coherent Phonon Scattering in Epitaxial Oxide Superlattices
,” Nat. Mater.
, 13
(2
), pp. 168
–172
.93.
Cahill
, D. G.
, 2004
, “Analysis of Heat Flow in Layered Structures for Time-Domain Thermoreflectance
,” Rev. Sci. Instrum.
, 75
(12
), pp. 5119
–5122
.94.
Schmidt
, A. J.
, Alper
, J. D.
, Chiesa
, M.
, Chen
, G.
, Das
, S. K.
, and Hamad-Schifferli
, K.
, 2008
, “Probing the Gold Nanorod−Ligand−Solvent Interface by Plasmonic Absorption and Thermal Decay
,” J. Phys. Chem. C
, 112
(35
), pp. 13320
–13323
.95.
Ge
, Z.
, Cahill
, D. G.
, and Braun
, P. V.
, 2006
, “Thermal Conductance of Hydrophilic and Hydrophobic Interfaces
,” Phys. Rev. Lett.
, 96
(18
), p. 186101
.96.
Schmidt
, A. J.
, Cheaito
, R.
, and Chiesa
, M.
, 2009
, “A Frequency-Domain Thermoreflectance Method for the Characterization of Thermal Properties
,” Rev. Sci. Instrum.
, 80
(9
), p. 94901
.97.
Schmidt
, A. J.
, Cheaito
, R.
, and Chiesa
, M.
, 2010
, “Characterization of Thin Metal Films Via Frequency-Domain Thermoreflectance
,” J. Appl. Phys.
, 107
(2
), p. 24908
.98.
Schmidt
, A. J.
, Chen
, X.
, and Chen
, G.
, 2008
, “Pulse Accumulation, Radial Heat Conduction, and Anisotropic Thermal Conductivity in Pump-Probe Transient Thermoreflectance
,” Rev. Sci. Instrum.
, 79
(11
), p. 114902
.99.
Siemens
, M. E.
, Li
, Q.
, Yang
, R.
, Nelson
, K. A.
, Anderson
, E. H.
, Murnane
, M. M.
, and Kapteyn
, H. C.
, 2010
, “Quasi-Ballistic Thermal Transport From Nanoscale Interfaces Observed Using Ultrafast Coherent Soft X-Ray Beams
,” Nat. Mater.
, 9
(1
), pp. 26
–30
.100.
Hoogeboom-Pot
, K. M.
, Hernandez-Charpak
, J. N.
, Gu
, X.
, Frazer
, T. D.
, Anderson
, E. H.
, Chao
, W.
, Falcone
, R. W.
, Yang
, R.
, Murnane
, M. M.
, Kapteyn
, H. C.
, and Nardi
, D.
, 2015
, “A New Regime of Nanoscale Thermal Transport: Collective Diffusion Increases Dissipation Efficiency
,” Proc. Natl. Acad. Sci.
, 112
(16
), pp. 4846
–4851
.101.
Wilson
, R. B.
, and Cahill
, D. G.
, 2014
, “Anisotropic Failure of Fourier Theory in Time-Domain Thermoreflectance Experiments
,” Nat. Commun.
, 5
, p. 5075
.102.
Hu
, Y.
, Zeng
, L.
, Minnich
, A. J.
, Dresselhaus
, M. S.
, and Chen
, G.
, 2015
, “Spectral Mapping of Thermal Conductivity Through Nanoscale Ballistic Transport
,” Nat. Nanotechnol.
, 10
(8
), pp. 701
–706
.103.
Capinski
, W. S.
, Maris
, H. J.
, Ruf
, T.
, Cardona
, M.
, Ploog
, K.
, and Katzer
, D. S.
, 1999
, “Thermal-Conductivity Measurements of GaAs/AlAs Superlattices Using a Picosecond Optical Pump-and-Probe Technique
,” Phys. Rev. B
, 59
(12
), pp. 8105
–8113
.104.
Zhu
, J.
, Tang
, D.
, Wang
, W.
, Liu
, J.
, Holub
, K. W.
, and Yang
, R.
, 2010
, “Ultrafast Thermoreflectance Techniques for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films
,” J. Appl. Phys.
, 108
(9
), p. 94315
.105.
Malen
, J. A.
, Baheti
, K.
, Tong
, T.
, Zhao
, Y.
, Hudgings
, J. A.
, and Majumdar
, A.
, 2011
, “Optical Measurement of Thermal Conductivity Using Fiber Aligned Frequency Domain Thermoreflectance
,” ASME J. Heat Transfer
, 133
(8
), p. 081601
.106.
Schmidt
, A. J.
, 2013
, “Pump-Probe Thermoreflectance
,” Annu. Rev. Heat Transfer
, 16
(1
), pp. 159
–181
.107.
Kang
, K.
, Koh
, Y. K.
, Chiritescu
, C.
, Zheng
, X.
, and Cahill
, D. G.
, 2008
, “Two-Tint Pump-Probe Measurements Using a Femtosecond Laser Oscillator and Sharp-Edged Optical Filters
,” Rev. Sci. Instrum.
, 79
(11
), p. 114901
.108.
Schmidt
, A.
, Chiesa
, M.
, Chen
, X.
, and Chen
, G.
, 2008
, “An Optical Pump-Probe Technique for Measuring the Thermal Conductivity of Liquids
,” Rev. Sci. Instrum.
, 79
(6
), p. 64902
.109.
Koh
, Y. K.
, Cahill
, D. G.
, and Sun
, B.
, 2014
, “Nonlocal Theory for Heat Transport at High Frequencies
,” Phys. Rev. B
, 90
(20
), p. 205412
.110.
Davidon
, W.
, 1991
, “Variable Metric Method for Minimization
,” SIAM J. Optim.
, 1
(1
), pp. 1
–17
.111.
Nelder
, J. A.
, and Mead
, R.
, 1965
, “A Simplex Method for Function Minimization
,” Comput. J.
, 7
(4
), pp. 308
–313
.112.
Yang
, J.
, Maragliano
, C.
, and Schmidt
, A. J.
, 2013
, “Thermal Property Microscopy With Frequency Domain Thermoreflectance
,” Rev. Sci. Instrum.
, 84
(10
), p. 104904
.113.
Regner
, K. T.
, Majumdar
, S.
, and Malen
, J. A.
, 2013
, “Instrumentation of Broadband Frequency Domain Thermoreflectance for Measuring Thermal Conductivity Accumulation Functions
,” Rev. Sci. Instrum.
, 84
(6
), p. 64901
.114.
Cahill
, D. G.
, and Watanabe
, F.
, 2004
, “Thermal Conductivity of Isotopically Pure and Ge-Doped Si Epitaxial Layers From 300 to 550 K
,” Phys. Rev. B
, 70
(23
), p. 235322
.115.
Liu
, J.
, Zhu
, J.
, Tian
, M.
, Gu
, X.
, Schmidt
, A.
, and Yang
, R.
, 2013
, “Simultaneous Measurement of Thermal Conductivity and Heat Capacity of Bulk and Thin Film Materials Using Frequency-Dependent Transient Thermoreflectance Method
,” Rev. Sci. Instrum.
, 84
(3
), p. 34902
.116.
Huang
, J.
, Park
, J.
, Wang
, W.
, Murphy
, C. J.
, and Cahill
, D. G.
, 2012
, “Ultrafast Thermal Analysis of Surface Functionalized Gold Nanorods in Aqueous Solution
,” ACS Nano
, 7
(1
), pp. 589
–597
.117.
Harikrishna
, H.
, Ducker
, W. A.
, and Huxtable
, S. T.
, 2013
, “The Influence of Interface Bonding on Thermal Transport Through Solid–Liquid Interfaces
,” Appl. Phys. Lett.
, 102
(25
), p. 251606
.118.
Losego
, M. D.
, Grady
, M. E.
, Sottos
, N. R.
, Cahill
, D. G.
, and Braun
, P. V.
, 2012
, “Effects of Chemical Bonding on Heat Transport Across Interfaces
,” Nat. Mater.
, 11
(6
), pp. 502
–506
.119.
Lyeo
, H.-K.
, and Cahill
, D. G.
, 2006
, “Thermal Conductance of Interfaces Between Highly Dissimilar Materials
,” Phys. Rev. B
, 73
(14
), p. 144301
.120.
Costescu
, R. M.
, Wall
, M. A.
, and Cahill
, D. G.
, 2003
, “Thermal Conductance of Epitaxial Interfaces
,” Phys. Rev. B
, 67
(5
), p. 54302
.121.
Ziade
, E.
, Yang
, J.
, Brummer
, G.
, Nothern
, D.
, Moustakas
, T.
, and Schmidt
, A. J.
, 2015
, “Thermal Transport Through GaN–SiC Interfaces From 300 to 600 K
,” Appl. Phys. Lett.
, 107
(9
), p. 91605
.122.
Donovan
, B. F.
, Szwejkowski
, C. J.
, Duda
, J. C.
, Cheaito
, R.
, Gaskins
, J. T.
, Yang
, C.-Y. P.
, Constantin
, C.
, Jones
, R. E.
, and Hopkins
, P. E.
, 2014
, “Thermal Boundary Conductance Across Metal-Gallium Nitride Interfaces From 80 to 450 K
,” Appl. Phys. Lett.
, 105
(20
), p. 203502
.123.
Freedman
, J. P.
, Yu
, X.
, Davis
, R. F.
, Gellman
, A. J.
, and Malen
, J. A.
, 2016
, “Thermal Interface Conductance Across Metal Alloy–Dielectric Interfaces
,” Phys. Rev. B
, 93
(3
), p. 35309
.124.
Huxtable
, S. T.
, Cahill
, D. G.
, Shenogin
, S.
, Xue
, L.
, Ozisik
, R.
, Barone
, P.
, Usrey
, M.
, Strano
, M. S.
, Siddons
, G.
, Shim
, M.
, and Keblinski
, P.
, 2003
, “Interfacial Heat Flow in Carbon Nanotube Suspensions
,” Nat. Mater.
, 2
(11
), pp. 731
–734
.125.
Schmidt
, A. J.
, Collins
, K. C.
, Minnich
, A. J.
, and Chen
, G.
, 2010
, “Thermal Conductance and Phonon Transmissivity of Metal–Graphite Interfaces
,” J. Appl. Phys.
, 107
(10
), p. 104907
.126.
Gao
, Y.
, Marconnet
, A. M.
, Xiang
, R.
, Maruyama
, S.
, and Goodson
, K. E.
, 2013
, “Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single-Walled Carbon Nanotube Films Using Frequency-Domain Thermoreflectance
,” IEEE Trans. Compon. Packag. Manuf. Technol.
, 3
(9
), pp. 1524
–1532
.127.
Feser
, J. P.
, Liu
, J.
, and Cahill
, D. G.
, 2014
, “Pump-Probe Measurements of the Thermal Conductivity Tensor for Materials Lacking In-Plane Symmetry
,” Rev. Sci. Instrum.
, 85
(10
), p. 104903
.128.
Liu
, J.
, Choi
, G.-M.
, and Cahill
, D. G.
, 2014
, “Measurement of the Anisotropic Thermal Conductivity of Molybdenum Disulfide by the Time-Resolved Magneto-Optic Kerr Effect
,” J. Appl. Phys.
, 116
(23
), p. 233107
.129.
Jang
, H.
, Wood
, J. D.
, Ryder
, C. R.
, Hersam
, M. C.
, and Cahill
, D. G.
, 2015
, “Anisotropic Thermal Conductivity of Exfoliated Black Phosphorus
,” Adv. Mater.
, 27
(48
), pp. 8017
–8022
.130.
Zhu
, J.
, Park
, H.
, Chen
, J.-Y.
, Gu
, X.
, Zhang
, H.
, Karthikeyan
, S.
, Wendel
, N.
, Campbell
, S. A.
, Dawber
, M.
, Du
, X.
, Li
, M.
, Wang
, J.-P.
, Yang
, R.
, and Wang
, X.
, 2016
, “Revealing the Origins of 3D Anisotropic Thermal Conductivities of Black Phosphorus
,” Adv. Electron. Mater.
, 2
(5
), p. 1600040
.131.
Liu
, J.
, Yoon
, B.
, Kuhlmann
, E.
, Tian
, M.
, Zhu
, J.
, George
, S. M.
, Lee
, Y.-C.
, and Yang
, R.
, 2013
, “Ultralow Thermal Conductivity of Atomic/Molecular Layer-Deposited Hybrid Organic–Inorganic Zincone Thin Films
,” Nano Lett.
, 13
(11
), pp. 5594
–5599
.132.
Ong
, W.-L.
, Rupich
, S. M.
, Talapin
, D. V.
, McGaughey
, A. J. H.
, and Malen
, J. A.
, 2013
, “Surface Chemistry Mediates Thermal Transport in Three-Dimensional Nanocrystal Arrays
,” Nat. Mater.
, 12
(5
), pp. 410
–415
.133.
Wang
, X.
, Liman
, C. D.
, Treat
, N. D.
, Chabinyc
, M. L.
, and Cahill
, D. G.
, 2013
, “Ultralow Thermal Conductivity of Fullerene Derivatives
,” Phys. Rev. B
, 88
(7
), p. 75310
.134.
Duda
, J. C.
, Hopkins
, P. E.
, Shen
, Y.
, and Gupta
, M. C.
, 2013
, “Exceptionally Low Thermal Conductivities of Films of the Fullerene Derivative PCBM
,” Phys. Rev. Lett.
, 110
(1
), p. 15902
.135.
Yang
, J.
, Ziade
, E.
, Maragliano
, C.
, Crowder
, R.
, Wang
, X.
, Stefancich
, M.
, Chiesa
, M.
, Swan
, A. K.
, and Schmidt
, A. J.
, 2014
, “Thermal Conductance Imaging of Graphene Contacts
,” J. Appl. Phys.
, 116
(2
), p. 23515
.136.
Bozorg-Grayeli
, E.
, Sood
, A.
, Asheghi
, M.
, Gambin
, V.
, Sandhu
, R.
, Feygelson
, T. I.
, Pate
, B. B.
, Hobart
, K.
, and Goodson
, K. E.
, 2013
, “Thermal Conduction Inhomogeneity of Nanocrystalline Diamond Films by Dual-Side Thermoreflectance
,” Appl. Phys. Lett.
, 102
(11
), p. 111907
.137.
Cho
, J.
, Li
, Z.
, Bozorg-Grayeli
, E.
, Kodama
, T.
, Francis
, D.
, Ejeckam
, F.
, Faili
, F.
, Asheghi
, M.
, and Goodson
, K. E.
, 2013
, “Improved Thermal Interfaces of GaN-Diamond Composite Substrates for HEMT Applications
,” IEEE Trans. Compon. Packag. Manuf. Technol.
, 3
(1
), pp. 79
–85
.138.
Chiritescu
, C.
, Cahill
, D. G.
, Nguyen
, N.
, Johnson
, D.
, Bodapati
, A.
, Keblinski
, P.
, and Zschack
, P.
, 2007
, “Ultralow Thermal Conductivity in Disordered, Layered WSe2 Crystals
,” Science
, 315
(5810
), pp. 351
–353
.139.
Ezzahri
, Y.
, Grauby
, S.
, Dilhaire
, S.
, Rampnoux
, J. M.
, and Claeys
, W.
, 2007
, “Cross-Plan Si /SiGe Superlattice Acoustic and Thermal Properties Measurement by Picosecond Ultrasonics
,” J. Appl. Phys.
, 101
(1
), p. 013705
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