Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient hot-wire method, laser flash diffusivity method, and transient plane source (TPS) method are most used. For thin film measurement, the 3ω method and the transient thermoreflectance technique including both time-domain and frequency-domain analysis are widely employed. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interfacial thermal conductance with less than 5% error. Selecting a specific measurement technique to characterize thermal properties needs to be based on: (1) knowledge on the sample whose thermophysical properties are to be determined, including the sample geometry and size, and the material preparation method; (2) understanding of fundamentals and procedures of the testing technique, for example, some techniques are limited to samples with specific geometries and some are limited to a specific range of thermophysical properties; and (3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.
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December 2016
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Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials Available to Purchase
Dongliang Zhao,
Dongliang Zhao
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
University of Colorado,
Boulder, CO 80309-0427
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Xin Qian,
Xin Qian
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
University of Colorado,
Boulder, CO 80309-0427
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Xiaokun Gu,
Xiaokun Gu
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
University of Colorado,
Boulder, CO 80309-0427
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Saad Ayub Jajja,
Saad Ayub Jajja
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
University of Colorado,
Boulder, CO 80309-0427
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Ronggui Yang
Ronggui Yang
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
e-mail: [email protected]
University of Colorado,
Boulder, CO 80309-0427
e-mail: [email protected]
Search for other works by this author on:
Dongliang Zhao
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
University of Colorado,
Boulder, CO 80309-0427
Xin Qian
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
University of Colorado,
Boulder, CO 80309-0427
Xiaokun Gu
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
University of Colorado,
Boulder, CO 80309-0427
Saad Ayub Jajja
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
University of Colorado,
Boulder, CO 80309-0427
Ronggui Yang
Department of Mechanical Engineering,
University of Colorado,
Boulder, CO 80309-0427
e-mail: [email protected]
University of Colorado,
Boulder, CO 80309-0427
e-mail: [email protected]
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received May 26, 2016; final manuscript received August 30, 2016; published online October 6, 2016. Assoc. Editor: Mehdi Asheghi.
J. Electron. Packag. Dec 2016, 138(4): 040802 (19 pages)
Published Online: October 6, 2016
Article history
Received:
May 26, 2016
Revised:
August 30, 2016
Citation
Zhao, D., Qian, X., Gu, X., Jajja, S. A., and Yang, R. (October 6, 2016). "Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials." ASME. J. Electron. Packag. December 2016; 138(4): 040802. https://doi.org/10.1115/1.4034605
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